Wayne Huang

548 total citations
16 papers, 456 citations indexed

About

Wayne Huang is a scholar working on Electrical and Electronic Engineering, Materials Chemistry and Biomedical Engineering. According to data from OpenAlex, Wayne Huang has authored 16 papers receiving a total of 456 indexed citations (citations by other indexed papers that have themselves been cited), including 11 papers in Electrical and Electronic Engineering, 10 papers in Materials Chemistry and 6 papers in Biomedical Engineering. Recurrent topics in Wayne Huang's work include Advanced Surface Polishing Techniques (6 papers), Electrocatalysts for Energy Conversion (5 papers) and Corrosion Behavior and Inhibition (4 papers). Wayne Huang is often cited by papers focused on Advanced Surface Polishing Techniques (6 papers), Electrocatalysts for Energy Conversion (5 papers) and Corrosion Behavior and Inhibition (4 papers). Wayne Huang collaborates with scholars based in United States. Wayne Huang's co-authors include John W. Weidner, Srini Raghavan, Robert J. Small, Ralph E. White, Andrew T. Haug, Balasubramanian Lakshmanan, Narender Rana, Timothy C. Stoner, S. Raghavan and Nancy W. Eilerts and has published in prestigious journals such as Journal of the American Chemical Society, Journal of The Electrochemical Society and Electrochemical and Solid-State Letters.

In The Last Decade

Wayne Huang

15 papers receiving 443 citations

Peers

Wayne Huang

EEE

RESE

EOMM

Oleg Brylev Russia

Egor V. Lobiak Russia

Weijia Liu China

Weixing Zhao China

Sumit Sachdeva Netherlands

M. Santa Germany

Mahesh D. Chaudhary India

Yue Shen China

Haolan Tao China

Oleg Brylev Russia

Wayne Huang

264 ×0.8

EEE

178 ×0.9

RESE

178 ×1.1

72 ×0.5

76 ×1.7

EOMM

Citations per year, relative to Wayne Huang Wayne Huang (= 1×) peers Oleg Brylev

Countries citing papers authored by Wayne Huang

Since Specialization

Citations

This map shows the geographic impact of Wayne Huang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Wayne Huang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Wayne Huang more than expected).

Fields of papers citing papers by Wayne Huang

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Wayne Huang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Wayne Huang. The network helps show where Wayne Huang may publish in the future.

Co-authorship network of co-authors of Wayne Huang

This figure shows the co-authorship network connecting the top 25 collaborators of Wayne Huang. A scholar is included among the top collaborators of Wayne Huang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Wayne Huang. Wayne Huang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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16 of 16 papers shown

Huang, Wayne, et al.. (2006). Galvanic Corrosion Between Copper and Tantalum under CMP Conditions. Journal of The Electrochemical Society. 153(4). F53–F53. 29 indexed citations

Huang, Wayne, et al.. (2004). Electrochemical Treatment of Simulated Copper CMP Wastewater Using Boron Doped Diamond Thin Film Electrodes—A Feasibility Study. IEEE Transactions on Semiconductor Manufacturing. 17(3). 448–454. 14 indexed citations

Huang, Wayne, et al.. (2004). Material Removal and Particulate Generation During Abrasion of Copper Films Using a Fixed Abrasive Pad. IEEE Transactions on Semiconductor Manufacturing. 17(4). 525–530. 4 indexed citations

Huang, Wayne, et al.. (2003). Corrosion Inhibaitors for Copper in Hydroxylamine-Based Chemistries Used for CMP and Post-CMP Cleaning. Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena. 92. 271–274. 2 indexed citations

Huang, Wayne, et al.. (2003). Interaction Between Ceria and Hydroxylamine. MRS Proceedings. 767. 6 indexed citations

Huang, Wayne, et al.. (2003). Dissolution of copper thin films in hydroxylamine-based solutions. International Journal of Mineral Processing. 72(1-4). 365–372. 18 indexed citations

Lakshmanan, Balasubramanian, et al.. (2003). Polyetheretherketone Membranes for Elevated Temperature PEMFCs. Electrochemical and Solid-State Letters. 6(12). A282–A282. 52 indexed citations

Haug, Andrew T., Ralph E. White, John W. Weidner, et al.. (2002). Increasing Proton Exchange Membrane Fuel Cell Catalyst Effectiveness Through Sputter Deposition. Journal of The Electrochemical Society. 149(3). A280–A280. 92 indexed citations

Huang, Wayne, et al.. (2002). Potential-pH Diagrams of Interest to Chemical Mechanical Planarization of Copper. Journal of The Electrochemical Society. 149(12). G638–G638. 107 indexed citations

10.

Haug, Andrew T., Ralph E. White, John W. Weidner, & Wayne Huang. (2002). Development of a Novel CO Tolerant Proton Exchange Membrane Fuel Cell Anode. Journal of The Electrochemical Society. 149(7). A862–A862. 47 indexed citations

11.

Lakshmanan, Balasubramanian, Wayne Huang, & John W. Weidner. (2002). Electrochemical Filtering of CO from Fuel-Cell Reformate. Electrochemical and Solid-State Letters. 5(12). A267–A267. 13 indexed citations

12.

Haug, Andrew T., Ralph E. White, John W. Weidner, et al.. (2002). Using Sputter Deposition to Increase CO Tolerance in a Proton-Exchange Membrane Fuel Cell. Journal of The Electrochemical Society. 149(7). A868–A868. 28 indexed citations

13.

Huang, Wayne, et al.. (2001). Effect of Surface Charge and Fluid Properties on Particle Removal Characteristics of a Surface-Optimized REB Filter. Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena. 76-77. 271–274. 1 indexed citations

14.

Huang, Wayne, S. Raghavan, Yin Fang, & Longhui Zhang. (1999). Electrochemical Behavior of Copper in Tetramethyl Ammonium Hydroxide Based Solutions. MRS Proceedings. 566. 10 indexed citations

15.

Eilerts, Nancy W., et al.. (1994). The role of two-component catalysts containing chelating bisaryloxide ligands in controlling the stereochemistry of the metathesis polymerization of norbornene. Polyhedron. 13(8). 1267–1275. 18 indexed citations

16.

Morton, Martha, Joseph A. Heppert, Wayne Huang, et al.. (1993). Ring size effects in phenol-phenolate tungsten (VI) chelates. Journal of the American Chemical Society. 115(17). 7916–7917. 15 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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