Tzu-Hsuan Tsai

619 total citations
24 papers, 523 citations indexed

About

Tzu-Hsuan Tsai is a scholar working on Electrical and Electronic Engineering, Materials Chemistry and Mechanical Engineering. According to data from OpenAlex, Tzu-Hsuan Tsai has authored 24 papers receiving a total of 523 indexed citations (citations by other indexed papers that have themselves been cited), including 22 papers in Electrical and Electronic Engineering, 8 papers in Materials Chemistry and 7 papers in Mechanical Engineering. Recurrent topics in Tzu-Hsuan Tsai's work include Electrokinetic Soil Remediation Techniques (6 papers), Advanced Surface Polishing Techniques (6 papers) and Electrodeposition and Electroless Coatings (4 papers). Tzu-Hsuan Tsai is often cited by papers focused on Electrokinetic Soil Remediation Techniques (6 papers), Advanced Surface Polishing Techniques (6 papers) and Electrodeposition and Electroless Coatings (4 papers). Tzu-Hsuan Tsai collaborates with scholars based in Taiwan, China and Australia. Tzu-Hsuan Tsai's co-authors include Yung‐Fu Wu, Shi‐Chern Yen, Yu‐Hsin Chen, Jinyi Lin, Yaqiong Li, Lifeng Zhang and Sivakumar Musuvadhi Babulal and has published in prestigious journals such as Journal of The Electrochemical Society, Journal of Hazardous Materials and Applied Surface Science.

In The Last Decade

Tzu-Hsuan Tsai

23 papers receiving 507 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Tzu-Hsuan Tsai Taiwan 14 271 231 167 166 58 24 523
C.S. Harendranath India 14 186 0.7× 121 0.5× 174 1.0× 336 2.0× 53 0.9× 28 658
Liaosha Li China 15 125 0.5× 156 0.7× 296 1.8× 206 1.2× 27 0.5× 48 553
Chris Yang United States 9 448 1.7× 285 1.2× 67 0.4× 176 1.1× 21 0.4× 20 615
Guoyu Qian China 15 133 0.5× 75 0.3× 345 2.1× 126 0.8× 101 1.7× 46 502
Émilie Planès France 20 559 2.1× 114 0.5× 69 0.4× 322 1.9× 47 0.8× 63 915
Igor Skryabin Australia 15 152 0.6× 125 0.5× 118 0.7× 93 0.6× 18 0.3× 31 579
Lingchen Kong China 16 427 1.6× 101 0.4× 134 0.8× 135 0.8× 24 0.4× 29 629
R. Pratibha Nalini India 9 141 0.5× 365 1.6× 108 0.6× 196 1.2× 21 0.4× 19 605
Yaozu Wang China 16 127 0.5× 201 0.9× 420 2.5× 182 1.1× 15 0.3× 65 683

Countries citing papers authored by Tzu-Hsuan Tsai

Since Specialization
Citations

This map shows the geographic impact of Tzu-Hsuan Tsai's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tzu-Hsuan Tsai with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tzu-Hsuan Tsai more than expected).

Fields of papers citing papers by Tzu-Hsuan Tsai

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Tzu-Hsuan Tsai. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tzu-Hsuan Tsai. The network helps show where Tzu-Hsuan Tsai may publish in the future.

Co-authorship network of co-authors of Tzu-Hsuan Tsai

This figure shows the co-authorship network connecting the top 25 collaborators of Tzu-Hsuan Tsai. A scholar is included among the top collaborators of Tzu-Hsuan Tsai based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Tzu-Hsuan Tsai. Tzu-Hsuan Tsai is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Tsai, Tzu-Hsuan, Sivakumar Musuvadhi Babulal, & Yung‐Fu Wu. (2024). Numerical simulation and experimental study on electrochemical recovery of copper using cylindrical and conical flow reactors. International Journal of Electrochemical Science. 20(1). 100894–100894.
2.
Tsai, Tzu-Hsuan, et al.. (2020). Removal of nickel from chemical plating waste solution through precipitation and production of microsized nickel hydroxide particles. Separation and Purification Technology. 251. 117315–117315. 32 indexed citations
3.
Li, Yaqiong, et al.. (2020). Bulk Si production from Si–Fe melts under temperature gradients, part I: Growth and characterization. Journal of Materials Research and Technology. 9(6). 12595–12603. 5 indexed citations
4.
Wu, Yung‐Fu, Tzu-Hsuan Tsai, & Jinyi Lin. (2019). Some Aspects of Mechanism of Electropolishing of Copper in Phosphoric Acid. International Journal of Electrochemical Science. 14(12). 11035–11047. 5 indexed citations
5.
Tsai, Tzu-Hsuan & Yung‐Fu Wu. (2018). Recovery of Submicron-Sized Silicon-Rich Powder from Silicon Sawing Waste for Electrocatalyst of Methanol Electrooxidation. International Journal of Electrochemical Science. 13(7). 6880–6896. 3 indexed citations
6.
Tsai, Tzu-Hsuan, et al.. (2014). Recovering low-turbidity cutting liquid from silicon slurry waste. Journal of Hazardous Materials. 271. 252–257. 11 indexed citations
7.
Tsai, Tzu-Hsuan, et al.. (2013). Recycling silicon wire-saw slurries: Separation of silicon and silicon carbide in a ramp settling tank under an applied electrical field. Journal of the Air & Waste Management Association. 63(5). 521–527. 31 indexed citations
8.
Tsai, Tzu-Hsuan. (2011). Silicon sawing waste treatment by electrophoresis and gravitational settling. Journal of Hazardous Materials. 189(1-2). 526–530. 56 indexed citations
9.
Tsai, Tzu-Hsuan. (2011). Iron Removal during Recovery of Silicon from Sawing Waste by Applying Magnetic Field. Separation Science and Technology. 46(5). 702–707. 2 indexed citations
10.
Tsai, Tzu-Hsuan. (2011). Modified sedimentation system for improving separation of silicon and silicon carbide in recycling of sawing waste. Separation and Purification Technology. 78(1). 16–20. 43 indexed citations
11.
Tsai, Tzu-Hsuan, et al.. (2010). Copper electrodeposition in a through-silicon via evaluated by rotating disc electrode techniques. Journal of Micromechanics and Microengineering. 20(11). 115023–115023. 11 indexed citations
12.
Tsai, Tzu-Hsuan, et al.. (2010). Electrochemical investigations for copper electrodeposition of through-silicon via. Microelectronic Engineering. 88(2). 195–199. 47 indexed citations
13.
Tsai, Tzu-Hsuan. (2009). Pretreatment of recycling wiresaw slurries—Iron removal using acid treatment and electrokinetic separation. Separation and Purification Technology. 68(1). 24–29. 17 indexed citations
14.
Tsai, Tzu-Hsuan, et al.. (2009). Metal removal from silicon sawing waste using the electrokinetic method. Journal of the Taiwan Institute of Chemical Engineers. 40(1). 1–5. 15 indexed citations
15.
Chen, Yu‐Hsin, et al.. (2009). Acetic acid and phosphoric acid adding to improve tantalum chemical mechanical polishing in hydrogen peroxide-based slurry. Microelectronic Engineering. 87(2). 174–179. 24 indexed citations
16.
Wu, Yung‐Fu & Tzu-Hsuan Tsai. (2007). Effect of organic acids on copper chemical mechanical polishing. Microelectronic Engineering. 84(12). 2790–2798. 22 indexed citations
17.
Tsai, Tzu-Hsuan & Yung‐Fu Wu. (2005). Wet etching mechanisms of ITO films in oxalic acid. Microelectronic Engineering. 83(3). 536–541. 42 indexed citations
18.
Tsai, Tzu-Hsuan, Yung‐Fu Wu, & Shi‐Chern Yen. (2004). Glycolic acid in hydrogen peroxide-based slurry for enhancing copper chemical mechanical polishing. Microelectronic Engineering. 77(3-4). 193–203. 26 indexed citations
19.
Tsai, Tzu-Hsuan & Shi‐Chern Yen. (2003). Localized corrosion effects and modifications of acidic and alkaline slurries on copper chemical mechanical polishing. Applied Surface Science. 210(3-4). 190–205. 49 indexed citations
20.
Tsai, Tzu-Hsuan, Yung‐Fu Wu, & Shi‐Chern Yen. (2003). A study of copper chemical mechanical polishing in urea–hydrogen peroxide slurry by electrochemical impedance spectroscopy. Applied Surface Science. 214(1-4). 120–135. 36 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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