Tuomas Happonen
Impact in
- Bioengineering top 5%
- Analytical Chemistry and Sensors
- Biomedical Engineering top 5%
- Advanced Sensor and Energy Harvesting Materials
- Biosensors and Analytical Detection
Papers in
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- Electronic Packaging and Soldering Technologies 12
- Nanomaterials and Printing Technologies 10
- 3D IC and TSV technologies 7
- Thin-Film Transistor Technologies 4
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- Advanced Sensor and Energy Harvesting Materials 12
- Co-authors
- Jussi Hiltunen (4 shared papers)Elina Jansson (3 shared papers)Tapio Fabritius (8 shared papers)Hnin Yin Yin Nyein (2 shared papers)Yuanjing Lin (2 shared papers)Mallika Bariya (2 shared papers)Ali Javey (2 shared papers)Liisa Kivimäki (2 shared papers)
- Journals
- The International Journal of Advanced Manufacturing Technology (3 papers)Flexible and Printed Electronics (3 papers)IEEE Transactions on Device and Materials Reliability (3 papers)IEEE Sensors Journal (2 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)
- Partner nations
- FinlandUnited KingdomUnited States
In The Last Decade
Tuomas Happonen
27 papers receiving 765 citations
Tuomas Happonen's Hit Papers
Peers
Comparison fields: 5 of 86
- Bioengineering 128
- Biomedical Engineering 578
- Polymers and Plastics 159
- Electrical and Electronic Engineering 439
- Automotive Engineering 59
Countries citing papers authored by Tuomas Happonen
This map shows the geographic impact of Tuomas Happonen's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tuomas Happonen with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tuomas Happonen more than expected).
Fields of papers citing papers by Tuomas Happonen
This network shows the impact of papers produced by Tuomas Happonen. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tuomas Happonen. The network helps show where Tuomas Happonen may publish in the future.
Co-authors
The 25 scholars most cited alongside Tuomas Happonen, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 29 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | Regional and correlative sweat analysis using high-throughput microfluidic sensing patches toward decoding sweat Hit paper breakdown → | 2019 | 303 |
| 2 | 2019 | 157 | |
| 3 | 2021 | 46 | |
| 4 | 2019 | 43 | |
| 5 | 2015 | 40 | |
| 6 | 2014 | 24 | |
| 7 | 2015 | 22 | |
| 8 | 2015 | 20 | |
| 9 | 2014 | 19 | |
| 10 | 2015 | 18 | |
| 11 | 2018 | 17 | |
| 12 | 2016 | 11 | |
| 13 | 2019 | 9 | |
| 14 | 2024 | 8 | |
| 15 | 2016 | 6 | |
| 16 | 2022 | 5 | |
| 17 | 2016 | 4 | |
| 18 | 2020 | 4 | |
| 19 | Reliability studies on printed conductors on flexible substrates under cyclic bending | 2016 | 4 |
| 20 | 2018 | 4 |
About Tuomas Happonen
Tuomas Happonen is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Automotive Engineering, Industrial and Manufacturing Engineering and Mechanics of Materials, having authored 29 papers that have together received 782 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (12 papers), Advanced Sensor and Energy Harvesting Materials (12 papers), Nanomaterials and Printing Technologies (10 papers), 3D IC and TSV technologies (7 papers), Thin-Film Transistor Technologies (4 papers), Recycling and Waste Management Techniques (3 papers), Additive Manufacturing and 3D Printing Technologies (3 papers) and Industrial Vision Systems and Defect Detection (2 papers). The work is most often cited by research in Bioengineering (128 citations), Biomedical Engineering (578 citations), Polymers and Plastics (159 citations), Electrical and Electronic Engineering (439 citations) and Automotive Engineering (59 citations). Tuomas Happonen has collaborated with scholars based in Finland, United Kingdom and United States. Frequent co-authors include Jussi Hiltunen, Elina Jansson, Tapio Fabritius, Hnin Yin Yin Nyein, Yuanjing Lin, Mallika Bariya, Ali Javey, Liisa Kivimäki, Christina Liedert and Sanna Uusitalo. Their work appears in journals such as The International Journal of Advanced Manufacturing Technology, Flexible and Printed Electronics, IEEE Transactions on Device and Materials Reliability, IEEE Sensors Journal and IEEE Transactions on Components Packaging and Manufacturing Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.