Teck Joo Goh
- Materials Chemistry top 10%
- Polymers and Plastics top 10%
- Biomedical Engineering
- Mechanical Engineering
- Mechanics of Materials top 10%
- Co-authors
- K. N. SeetharamuL.C. SimH. IsmailSutapa Roy RamananG.A. QuadirZ.A. ZainalChia‐Pin ChiuAmiza Amir
- Topics
- Electronic Packaging and Soldering Technologies (8 papers)3D IC and TSV technologies (7 papers)Heat Transfer and Optimization (5 papers)
- Partner nations
- MalaysiaUnited StatesChina
In The Last Decade
Teck Joo Goh
13 papers receiving 465 citations
Peers
Comparison fields: 5 of 45
- Materials Chemistry 359
- Polymers and Plastics 154
- Biomedical Engineering 118
- Mechanical Engineering 116
- Mechanics of Materials 98
Countries citing papers authored by Teck Joo Goh
This map shows the geographic impact of Teck Joo Goh's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Teck Joo Goh with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Teck Joo Goh more than expected).
Fields of papers citing papers by Teck Joo Goh
This network shows the impact of papers produced by Teck Joo Goh. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Teck Joo Goh. The network helps show where Teck Joo Goh may publish in the future.
Co-authorship network of co-authors of Teck Joo Goh
This figure shows the co-authorship network connecting the top 25 collaborators of Teck Joo Goh. A scholar is included among the top collaborators of Teck Joo Goh based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Teck Joo Goh. Teck Joo Goh is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 5 | |
| 2 | 2 | |
| 3 | 4 | |
| 4 | 426 | |
| 5 | 8 | |
| 6 | 4 | |
| 7 | 8 | |
| 8 | 1 | |
| 9 | 8 | |
| 10 | 1 | |
| 11 | 4 | |
| 12 | 7 | |
| 13 | 3 |
About Teck Joo Goh
Teck Joo Goh is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Materials Chemistry, having authored 13 papers that have together received 481 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (7 papers) and Heat Transfer and Optimization (5 papers). The work is most often cited by research in Polymers and Plastics (154 citations), Materials Chemistry (359 citations) and Ceramics and Composites (42 citations). Teck Joo Goh has collaborated with scholars based in Malaysia, United States and China. Frequent co-authors include K. N. Seetharamu, L.C. Sim, H. Ismail, Sutapa Roy Ramanan, G.A. Quadir, Z.A. Zainal, Chia‐Pin Chiu, Amiza Amir, Fangjun Hong and Hui Ge. Their work appears in journals such as Thermochimica Acta, Journal of Electronic Packaging and Microelectronics International.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.