Teck Joo Goh

564 total citations
13 papers, 481 citations indexed

About

Teck Joo Goh is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, Teck Joo Goh has authored 13 papers receiving a total of 481 indexed citations (citations by other indexed papers that have themselves been cited), including 10 papers in Electrical and Electronic Engineering, 7 papers in Mechanical Engineering and 4 papers in Materials Chemistry. Recurrent topics in Teck Joo Goh's work include Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (7 papers) and Heat Transfer and Optimization (5 papers). Teck Joo Goh is often cited by papers focused on Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (7 papers) and Heat Transfer and Optimization (5 papers). Teck Joo Goh collaborates with scholars based in Malaysia, United States and China. Teck Joo Goh's co-authors include K. N. Seetharamu, H. Ismail, Sutapa Roy Ramanan, L.C. Sim, G.A. Quadir, Z.A. Zainal, Chia‐Pin Chiu, Amiza Amir, Ishak Abdul Azid and Fangjun Hong and has published in prestigious journals such as Thermochimica Acta, Journal of Electronic Packaging and Microelectronics International.

In The Last Decade

Teck Joo Goh

13 papers receiving 465 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Teck Joo Goh Malaysia 6 359 154 118 116 98 13 481
Hyun Su Kim South Korea 7 323 0.9× 100 0.6× 90 0.8× 118 1.0× 97 1.0× 12 445
Chia-Ken Leong United States 11 295 0.8× 78 0.5× 66 0.6× 100 0.9× 124 1.3× 12 420
Jacob Lewis United States 6 460 1.3× 84 0.5× 128 1.1× 121 1.0× 106 1.1× 10 639
V. K. Sachdev India 15 164 0.5× 160 1.0× 131 1.1× 55 0.5× 22 0.2× 28 500
Matthew S. Radue United States 13 348 1.0× 268 1.7× 97 0.8× 307 2.6× 207 2.1× 23 653
Yuyao Sun China 6 191 0.5× 48 0.3× 103 0.9× 128 1.1× 50 0.5× 14 531
Chonung Kim China 13 324 0.9× 226 1.5× 165 1.4× 88 0.8× 39 0.4× 22 507
Jong‐Woo Bae South Korea 9 187 0.5× 186 1.2× 83 0.7× 87 0.8× 93 0.9× 22 370
Gurjot S. Dhaliwal United States 10 105 0.3× 156 1.0× 53 0.4× 118 1.0× 101 1.0× 23 379
Sathyanarayanan Raghavan United States 8 360 1.0× 69 0.4× 129 1.1× 104 0.9× 158 1.6× 11 539

Countries citing papers authored by Teck Joo Goh

Since Specialization
Citations

This map shows the geographic impact of Teck Joo Goh's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Teck Joo Goh with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Teck Joo Goh more than expected).

Fields of papers citing papers by Teck Joo Goh

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Teck Joo Goh. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Teck Joo Goh. The network helps show where Teck Joo Goh may publish in the future.

Co-authorship network of co-authors of Teck Joo Goh

This figure shows the co-authorship network connecting the top 25 collaborators of Teck Joo Goh. A scholar is included among the top collaborators of Teck Joo Goh based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Teck Joo Goh. Teck Joo Goh is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

13 of 13 papers shown
1.
Hong, Fangjun, Ping Cheng, Hui Ge, & Teck Joo Goh. (2006). Design of a Fractal Tree-Like Microchannel Net Heat Sink for Microelectronic Cooling. 305–311. 5 indexed citations
2.
Seetharamu, K.N., et al.. (2006). Application of artificial intelligence for the determination of package parameters for a desired solder joint fatigue life. Microelectronics International. 23(2). 37–44. 2 indexed citations
3.
Goh, Teck Joo, Chia‐Pin Chiu, K. N. Seetharamu, G.A. Quadir, & Z.A. Zainal. (2006). Test chip and substrate design for flip chip microelectronic package thermal measurements. Microelectronics International. 23(2). 3–10. 4 indexed citations
4.
Seetharamu, K. N., et al.. (2005). Optimization of fins used in electronic packaging. Microelectronics International. 22(1). 10–15. 8 indexed citations
5.
Sim, L.C., Sutapa Roy Ramanan, H. Ismail, K. N. Seetharamu, & Teck Joo Goh. (2005). Thermal characterization of Al2O3 and ZnO reinforced silicone rubber as thermal pads for heat dissipation purposes. Thermochimica Acta. 430(1-2). 155–165. 426 indexed citations
6.
Seetharamu, K. N., et al.. (2004). Fast transient solutions for heat transfer [FEM]. 3. 469–473. 4 indexed citations
7.
Goh, Teck Joo, et al.. (2004). Thermal investigations of microelectronic chip with non‐uniform power distribution: temperature prediction and thermal placement design optimization. Microelectronics International. 21(3). 29–43. 8 indexed citations
8.
Goh, Teck Joo, Chia‐Pin Chiu, K. N. Seetharamu, G.A. Quadir, & Z.A. Zainal. (2003). Flip Chip Thermal Test Vehicle Design: Requirements, Evaluations, and Validations. 323–330. 1 indexed citations
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Goh, Teck Joo. (2002). Parametric finite element analysis of solder joint reliability of flip chip on board. 2. 57–62. 4 indexed citations
12.
13.
Goh, Teck Joo. (2000). Thermal and Mechanical Loading Effects on the Reliability of Organic Flip Chip Package. Journal of Electronic Packaging. 123(1). 83–87. 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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2026