Tae‐Ik Lee

1.7k total citations · 1 hit paper
46 papers, 1.4k citations indexed

About

Tae‐Ik Lee is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Polymers and Plastics. According to data from OpenAlex, Tae‐Ik Lee has authored 46 papers receiving a total of 1.4k indexed citations (citations by other indexed papers that have themselves been cited), including 29 papers in Electrical and Electronic Engineering, 29 papers in Biomedical Engineering and 9 papers in Polymers and Plastics. Recurrent topics in Tae‐Ik Lee's work include Electronic Packaging and Soldering Technologies (22 papers), Advanced Sensor and Energy Harvesting Materials (21 papers) and 3D IC and TSV technologies (13 papers). Tae‐Ik Lee is often cited by papers focused on Electronic Packaging and Soldering Technologies (22 papers), Advanced Sensor and Energy Harvesting Materials (21 papers) and 3D IC and TSV technologies (13 papers). Tae‐Ik Lee collaborates with scholars based in South Korea, United States and Germany. Tae‐Ik Lee's co-authors include Taek‐Soo Kim, Donguk Kwon, Inkyu Park, Min Seong Kim, Seung‐Hwan Kim, Seunghwa Ryu, Jongmin Shim, Cheolgyu Kim, Min Sung Kim and Kyung‐Wook Paik and has published in prestigious journals such as ACS Nano, Advanced Functional Materials and Scientific Reports.

In The Last Decade

Tae‐Ik Lee

42 papers receiving 1.4k citations

Hit Papers

Highly Sensitive, Flexible, and Wearable Pressure Sensor ... 2016 2026 2019 2022 2016 100 200 300 400
What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

  1. Highly Sensitive, Flexible, and Wearable Pressure Sensor Based on a Giant Piezocapacitive Effect of Three-Dimensional Microporous Elastomeric Dielectric Layer
    2016 444 citations Donguk Kwon, Tae‐Ik Lee et al. ACS Applied Materials & Interfaces profile →

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Tae‐Ik Lee South Korea 19 1.1k 655 427 380 199 46 1.4k
Linpeng Liu China 21 1.1k 1.0× 375 0.6× 362 0.8× 425 1.1× 165 0.8× 55 1.4k
Yunong Zhao China 29 1.8k 1.6× 834 1.3× 646 1.5× 702 1.8× 218 1.1× 95 2.3k
Shixuan Yang United States 5 1.2k 1.1× 517 0.8× 546 1.3× 335 0.9× 223 1.1× 9 1.5k
Yong Whan Choi South Korea 12 1.7k 1.6× 878 1.3× 792 1.9× 793 2.1× 183 0.9× 21 2.1k
Jong‐Jin Park South Korea 13 1.0k 0.9× 510 0.8× 649 1.5× 255 0.7× 147 0.7× 42 1.2k
Sung Soo Shin South Korea 9 1.3k 1.2× 658 1.0× 548 1.3× 616 1.6× 134 0.7× 17 1.6k
Minkun Cai China 15 1.4k 1.3× 504 0.8× 487 1.1× 490 1.3× 192 1.0× 20 1.7k
Faheem Ershad United States 17 1.5k 1.4× 834 1.3× 754 1.8× 428 1.1× 254 1.3× 27 2.0k
Seongdong Lim South Korea 16 1.3k 1.2× 856 1.3× 550 1.3× 445 1.2× 168 0.8× 20 1.9k
Seung Hee Jeong Sweden 17 1.4k 1.3× 439 0.7× 369 0.9× 379 1.0× 508 2.6× 27 1.8k

Countries citing papers authored by Tae‐Ik Lee

Since Specialization
Citations

This map shows the geographic impact of Tae‐Ik Lee's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tae‐Ik Lee with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tae‐Ik Lee more than expected).

Fields of papers citing papers by Tae‐Ik Lee

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Tae‐Ik Lee. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tae‐Ik Lee. The network helps show where Tae‐Ik Lee may publish in the future.

Co-authorship network of co-authors of Tae‐Ik Lee

This figure shows the co-authorship network connecting the top 25 collaborators of Tae‐Ik Lee. A scholar is included among the top collaborators of Tae‐Ik Lee based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Tae‐Ik Lee. Tae‐Ik Lee is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Lee, Eun Hye, I.W. Kim, Jihyun Kim, et al.. (2025). A review of the thermo-mechanical analysis framework for microelectronics packaging: Mechanics, material property determination, and structural considerations. Materials Science in Semiconductor Processing. 205. 110321–110321.
2.
Lee, Eun Hye, et al.. (2024). Glycerol Vapor Assisted Cu Direct Bonding: Implications for 3D Semiconductor Packaging. Advanced Materials Technologies. 10(5).
3.
Kim, Yeon-Sik, et al.. (2024). Microwave Bonding of Thin Polymer Substrates Using Carbon Nanotubes for Flexible Interconnections. ACS Applied Nano Materials. 7(14). 16534–16541. 3 indexed citations
4.
Lee, Tae‐Ik, et al.. (2024). Direct Tensile Testing of Free‐Standing Ultrathin Polymer Films on Liquid Surface at High Temperature. Small Methods. 9(4). e2401291–e2401291. 2 indexed citations
5.
Jeong, Jong‐Min, et al.. (2023). Fast, facile and thermal damage free nanowelding of Ag nanowire for flexible transparent conductive film by pressure-assisted microwave irradiation. Scientific Reports. 13(1). 14354–14354. 5 indexed citations
6.
Jo, Woosung, Tae‐Ik Lee, & Taek‐Soo Kim. (2022). Enlarged tensile strain at edge of flexible substrate due to anticlastic curvature. Microelectronics Reliability. 130. 114485–114485. 3 indexed citations
7.
Lee, Tae‐Ik, et al.. (2022). Joint reliability of Al wire bonding on OSP and ENIG surface-finished substrates under complex stress induced with current and temperature. Journal of Materials Science Materials in Electronics. 33(26). 21127–21136. 1 indexed citations
8.
9.
Lee, Tae‐Ik, et al.. (2020). Creation of Curved Nanostructures Using Soft-Materials-Derived Lithography. Nanomaterials. 10(12). 2414–2414. 3 indexed citations
10.
Kim, Jae-Han, et al.. (2019). Thermal expansion behavior of thin films expanding freely on water surface. Scientific Reports. 9(1). 7071–7071. 33 indexed citations
11.
Kim, Dong Hyun, Jae Hyun Han, Yongmin Lee, et al.. (2019). Performance improvement of flexible piezoelectric energy harvester for irregular human motion with energy extraction enhancement circuit. Nano Energy. 58. 211–219. 93 indexed citations
12.
Kim, Seung‐Hwan, Morteza Amjadi, Tae‐Ik Lee, et al.. (2019). Wearable, Ultrawide-Range, and Bending-Insensitive Pressure Sensor Based on Carbon Nanotube Network-Coated Porous Elastomer Sponges for Human Interface and Healthcare Devices. ACS Applied Materials & Interfaces. 11(26). 23639–23648. 207 indexed citations
13.
Seo, Jeong‐Min, Boo Soo, Tae‐Ik Lee, et al.. (2018). Direct Graphene Transfer and Its Application to Transfer Printing Using Mechanically Controlled, Large Area Graphene/Copper Freestanding Layer. Advanced Functional Materials. 28(45). 8 indexed citations
14.
Kim, Cheolgyu, Tae‐Ik Lee, Min Sung Kim, & Taek‐Soo Kim. (2017). FEM simulation of warpage orientation change of FRP polymer substrate during thermal processing. 110. 422–423. 2 indexed citations
15.
16.
Kim, Jihye, Tae‐Ik Lee, Taek‐Soo Kim, & Kyung‐Wook Paik. (2017). The Effect of Anisotropic Conductive Films Adhesion on the Bending Reliability of Chip-in-Flex Packages for Wearable Electronics Applications. IEEE Transactions on Components Packaging and Manufacturing Technology. 7(10). 1583–1591. 26 indexed citations
17.
Lee, Tae‐Ik, et al.. (2016). Prediction of time-dependent swelling of flexible polymer substrates using hygro-mechanical finite element simulations. Soft Matter. 12(18). 4135–4141. 15 indexed citations
18.
Kim, Cheolgyu, Tae‐Ik Lee, & Taek‐Soo Kim. (2016). Measurement Technologies of Mechanical Properties of Polymers used for Flexible and Stretchable Electronic Packaging. Journal of the Microelectronics and Packaging Society. 23(2). 19–28. 1 indexed citations
19.
20.
Kim, Cheolgyu, et al.. (2014). Methodology development of warpage analysis of polymer based packaging substrate. 1004–1009. 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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