Sungdong Kim
- Health Informatics top 0.2%
- Artificial Intelligence top 0.2%
- Molecular Biology top 5%
- General Social Sciences top 1%
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- 3D IC and TSV technologies 24
- Electronic Packaging and Soldering Technologies 15
- Gas Sensing Nanomaterials and Sensors 6
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- Additive Manufacturing and 3D Printing Technologies 10
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- ZnO doping and properties 7
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- Heat Transfer and Optimization 5
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- Copper Interconnects and Reliability 5
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- Advanced Surface Polishing Techniques 5
Sungdong Kim
37 papers receiving 3.8k citations
Hit Papers
Peers
Comparison fields: 5 of 163
- Health Informatics 274
- Artificial Intelligence 2.8k
- Health Information Management 156
- Molecular Biology 1.5k
- General Social Sciences 53
Countries citing papers authored by Sungdong Kim
This map shows the geographic impact of Sungdong Kim's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Sungdong Kim with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Sungdong Kim more than expected).
Fields of papers citing papers by Sungdong Kim
This network shows the impact of papers produced by Sungdong Kim. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Sungdong Kim. The network helps show where Sungdong Kim may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Sungdong Kim, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2025 | 1 | |
| 2 | 2025 | 1 | |
| 3 | 2024 | 0 | |
| 4 | BioBERT: a pre-trained biomedical language representation model for biomedical text miningbreakdown → | 2019 | 3644 |
| 5 | 2018 | 1 | |
| 6 | 2017 | 13 | |
| 7 | 2017 | 4 | |
| 8 | 2016 | 12 | |
| 9 | 2016 | 3 | |
| 10 | 2016 | 17 | |
| 11 | 2016 | 13 | |
| 12 | 2014 | 48 | |
| 13 | 2014 | 42 | |
| 14 | 2013 | 28 | |
| 15 | 2013 | 3 | |
| 16 | 2012 | 3 | |
| 17 | 2012 | 1 | |
| 18 | The Effects of UBM and SnAgCu Solder on Drop Impact Reliability of Wafer Level Package | 2010 | 2 |
| 19 | 2009 | 8 | |
| 20 | 2001 | 5 |
About Sungdong Kim
Sungdong Kim is a scholar working on Automotive Engineering, Electrical and Electronic Engineering and Electronic, Optical and Magnetic Materials, having authored 42 papers that have together received 4.0k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (24 papers), Electronic Packaging and Soldering Technologies (15 papers), Additive Manufacturing and 3D Printing Technologies (10 papers), ZnO doping and properties (7 papers), Gas Sensing Nanomaterials and Sensors (6 papers), Heat Transfer and Optimization (5 papers), Copper Interconnects and Reliability (5 papers) and Advanced Surface Polishing Techniques (5 papers). The work is most often cited by research in Health Informatics (274 citations), Artificial Intelligence (2.8k citations) and Health Information Management (156 citations). Sungdong Kim has collaborated with scholars based in South Korea, Netherlands and United States. Frequent co-authors include Donghyeon Kim, Wonjin Yoon, Jinhyuk Lee, Sunkyu Kim, Jaewoo Kang, Sarah Eunkyung Kim, Joseph Um, Minjae Lee, Cheol Kim and Byoung‐Tak Zhang. Their work appears in journals such as Bioinformatics, Journal of Applied Physics and Applied Surface Science.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.