Sungdong Kim

7.2k total citations · 1 hit paper
42 papers, 4.0k citations indexed

About

Sungdong Kim is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Materials Chemistry. According to data from OpenAlex, Sungdong Kim has authored 42 papers receiving a total of 4.0k indexed citations (citations by other indexed papers that have themselves been cited), including 32 papers in Electrical and Electronic Engineering, 10 papers in Automotive Engineering and 9 papers in Materials Chemistry. Recurrent topics in Sungdong Kim's work include 3D IC and TSV technologies (24 papers), Electronic Packaging and Soldering Technologies (15 papers) and Additive Manufacturing and 3D Printing Technologies (10 papers). Sungdong Kim is often cited by papers focused on 3D IC and TSV technologies (24 papers), Electronic Packaging and Soldering Technologies (15 papers) and Additive Manufacturing and 3D Printing Technologies (10 papers). Sungdong Kim collaborates with scholars based in South Korea, Netherlands and United States. Sungdong Kim's co-authors include Wonjin Yoon, Jinhyuk Lee, Sunkyu Kim, Donghyeon Kim, Jaewoo Kang, Sarah Eunkyung Kim, Joseph Um, Minjae Lee, Cheol Kim and Younghak Cho and has published in prestigious journals such as Bioinformatics, Journal of Applied Physics and Applied Surface Science.

In The Last Decade

Sungdong Kim

37 papers receiving 3.8k citations

Hit Papers

BioBERT: a pre-trained biomedical language representation... 2019 2026 2021 2023 2019 1000 2.0k 3.0k
What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

  1. BioBERT: a pre-trained biomedical language representation model for biomedical text mining
    2019 3.6k citations Jinhyuk Lee, Wonjin Yoon et al. Bioinformatics profile →

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Sungdong Kim South Korea 12 2.8k 1.5k 274 248 229 42 4.0k
Hoifung Poon United States 25 3.3k 1.2× 1.0k 0.7× 327 1.2× 40 0.2× 227 1.0× 66 4.3k
Jinhyuk Lee South Korea 21 3.2k 1.1× 2.1k 1.4× 280 1.0× 23 0.1× 243 1.1× 43 4.6k
Casimir A. Kulikowski United States 20 1.1k 0.4× 698 0.5× 134 0.5× 52 0.2× 156 0.7× 122 2.7k
Jian Tang China 26 1.4k 0.5× 505 0.3× 64 0.2× 170 0.7× 94 0.4× 94 2.9k
Heimo Müller Austria 25 1.2k 0.4× 384 0.3× 661 2.4× 145 0.6× 407 1.8× 97 3.5k
Donghyeon Kim South Korea 8 3.0k 1.1× 1.7k 1.2× 280 1.0× 18 0.1× 235 1.0× 24 4.0k
José Luís Oliveira Portugal 29 966 0.3× 1.2k 0.8× 52 0.2× 57 0.2× 421 1.8× 263 3.2k
Wei Lu Singapore 33 3.9k 1.4× 580 0.4× 100 0.4× 98 0.4× 42 0.2× 127 4.9k
Goran Nenadić United Kingdom 29 1.6k 0.6× 1.5k 1.0× 102 0.4× 192 0.8× 91 0.4× 170 3.5k
Wonjin Yoon South Korea 6 2.9k 1.0× 1.6k 1.1× 279 1.0× 14 0.1× 235 1.0× 13 3.8k

Countries citing papers authored by Sungdong Kim

Since Specialization
Citations

This map shows the geographic impact of Sungdong Kim's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Sungdong Kim with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Sungdong Kim more than expected).

Fields of papers citing papers by Sungdong Kim

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Sungdong Kim. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Sungdong Kim. The network helps show where Sungdong Kim may publish in the future.

Co-authorship network of co-authors of Sungdong Kim

This figure shows the co-authorship network connecting the top 25 collaborators of Sungdong Kim. A scholar is included among the top collaborators of Sungdong Kim based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Sungdong Kim. Sungdong Kim is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
2.
Kang, Minji, et al.. (2025). The Role of Preparation and Bonding Parameters in Improving Hybrid Bonding Quality. 1827–1831. 1 indexed citations
3.
4.
Lee, Jinhyuk, Wonjin Yoon, Sungdong Kim, et al.. (2019). BioBERT: a pre-trained biomedical language representation model for biomedical text mining. Bioinformatics. 36(4). 1234–1240. 3644 indexed citations breakdown →
5.
Kim, Sungdong, et al.. (2018). Fabrication and Characteristics of Spin-on Dielectric for Multi-level Interconnect in WLP. 23. 1879–1884. 1 indexed citations
6.
Kim, Cheol, et al.. (2017). Transparent SnOx thin films fabricated by radio frequency reactive sputtering with a SnO/Sn composite target. Thin Solid Films. 634. 175–180. 13 indexed citations
7.
Kim, Cheol, et al.. (2017). Comparative Analysis of SnOxThin Films Deposited by RF Reactive Sputtering with Different SnO/Sn Target Compositions. ECS Journal of Solid State Science and Technology. 6(12). P765–P771. 4 indexed citations
8.
Kim, Sarah Eunkyung, et al.. (2016). Thermal assessment of copper through silicon via in 3D IC. Microelectronic Engineering. 156. 2–5. 12 indexed citations
9.
Kim, Sungdong, et al.. (2016). Experimental assessment of on-chip liquid cooling through microchannels with de-ionized water and diluted ethylene glycol. Japanese Journal of Applied Physics. 55(6S3). 06JB02–06JB02. 3 indexed citations
10.
Kim, Sungdong, et al.. (2016). Evaluation of Si liquid cooling structure with microchannel and TSV for 3D application. Microsystem Technologies. 23(7). 2609–2614. 17 indexed citations
11.
Kim, Sungdong, et al.. (2014). Argon plasma treatment on Cu surface for Cu bonding in 3D integration and their characteristics. Applied Surface Science. 324. 168–173. 48 indexed citations
12.
Kim, Sarah Eunkyung & Sungdong Kim. (2014). Wafer level Cu–Cu direct bonding for 3D integration. Microelectronic Engineering. 137. 158–163. 42 indexed citations
13.
Um, Joseph, et al.. (2013). Effect of radio frequency power on the properties of p-type SnO deposited via sputtering. Materials Science in Semiconductor Processing. 16(6). 1679–1683. 28 indexed citations
14.
Kim, Sungdong, et al.. (2013). TSV Liquid Cooling System for 3D Integrated Circuits. Journal of the Microelectronics and Packaging Society. 20(3). 1–6. 3 indexed citations
15.
Lee, Minjae, et al.. (2013). Development of Cu CMP process for Cu-to-Cu wafer stacking. Journal of the Microelectronics and Packaging Society. 20(4). 81–85. 1 indexed citations
16.
Kim, Eun‐Sol, et al.. (2012). Evaluation of wafer level Cu bonding for 3D integration. 1–2. 3 indexed citations
17.
Um, Joseph, et al.. (2012). Effect of RF Power on SnO Thin Films Obtained by Sputtering. Journal of the Korean Ceramic Society. 49(5). 399–403. 1 indexed citations
18.
Kim, Hyun Ho, Do‐Hyung Kim, Jong Bin Kim, et al.. (2010). The Effects of UBM and SnAgCu Solder on Drop Impact Reliability of Wafer Level Package. Journal of the Microelectronics and Packaging Society. 17(3). 65–69. 2 indexed citations
19.
Kim, Sungdong, et al.. (2009). Study on Exchange-Biased Perpendicular Magnetic Tunnel Junction Based on Pd/Co Multilayers. IEEE Transactions on Magnetics. 45(6). 2407–2409. 8 indexed citations
20.
Kim, Sungdong, et al.. (2001). Learning-based Intrasentence Segmentation for Efficient Translation of Long Sentences. Machine Translation. 16(3). 151–174. 5 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

Breakdown of academic impact, for papers by Hoifung Poon Breakdown of academic impact, for papers by Jinhyuk Lee Breakdown of academic impact, for papers by Casimir A. Kulikowski Breakdown of academic impact, for papers by Jian Tang Breakdown of academic impact, for papers by Heimo Müller Breakdown of academic impact, for papers by Donghyeon Kim Breakdown of academic impact, for papers by José Luís Oliveira Breakdown of academic impact, for papers by Wei Lu Breakdown of academic impact, for papers by Goran Nenadić Breakdown of academic impact, for papers by Wonjin Yoon
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