Shi-Yung Chiou

460 total citations
20 papers, 392 citations indexed

About

Shi-Yung Chiou is a scholar working on Mechanics of Materials, Electronic, Optical and Magnetic Materials and Electrical and Electronic Engineering. According to data from OpenAlex, Shi-Yung Chiou has authored 20 papers receiving a total of 392 indexed citations (citations by other indexed papers that have themselves been cited), including 9 papers in Mechanics of Materials, 9 papers in Electronic, Optical and Magnetic Materials and 8 papers in Electrical and Electronic Engineering. Recurrent topics in Shi-Yung Chiou's work include Copper Interconnects and Reliability (9 papers), Metal and Thin Film Mechanics (9 papers) and Semiconductor materials and devices (7 papers). Shi-Yung Chiou is often cited by papers focused on Copper Interconnects and Reliability (9 papers), Metal and Thin Film Mechanics (9 papers) and Semiconductor materials and devices (7 papers). Shi-Yung Chiou collaborates with scholars based in Taiwan and China. Shi-Yung Chiou's co-authors include Keng‐Liang Ou, Shih‐Fu Ou, Dershin Gan, Ming-Hong Lin, Hsin-Chung Cheng, Chang-Chih Chen, Mao-Suan Huang, Ker‐Chang Hsieh, Hsin‐Hua Chou and Chang‐Pin Chou and has published in prestigious journals such as Journal of The Electrochemical Society, Journal of Materials Science and Journal of Alloys and Compounds.

In The Last Decade

Shi-Yung Chiou

20 papers receiving 379 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Shi-Yung Chiou Taiwan 11 169 154 108 99 99 20 392
Federico Lasserre Germany 9 98 0.6× 145 0.9× 122 1.1× 191 1.9× 41 0.4× 13 405
Anoop Kumar Mukhopadhyay India 12 143 0.8× 195 1.3× 163 1.5× 116 1.2× 33 0.3× 20 365
Jacinto P. Borrajo Spain 15 240 1.4× 103 0.7× 47 0.4× 54 0.5× 92 0.9× 34 451
Takamitsu Fujiu Japan 9 214 1.3× 216 1.4× 38 0.4× 63 0.6× 124 1.3× 14 450
Getúlio de Vasconcelos Brazil 11 95 0.6× 166 1.1× 108 1.0× 113 1.1× 71 0.7× 40 338
Ilmārs Zālīte Latvia 11 104 0.6× 179 1.2× 79 0.7× 200 2.0× 31 0.3× 42 409
Sabri Altıntaş Türkiye 13 223 1.3× 283 1.8× 129 1.2× 277 2.8× 71 0.7× 44 600
M. Parco Spain 12 143 0.8× 259 1.7× 63 0.6× 271 2.7× 49 0.5× 19 568
Paola Pinasco Italy 15 175 1.0× 370 2.4× 77 0.7× 192 1.9× 138 1.4× 25 625
Magdalena Gawęda Poland 12 137 0.8× 226 1.5× 43 0.4× 56 0.6× 64 0.6× 23 402

Countries citing papers authored by Shi-Yung Chiou

Since Specialization
Citations

This map shows the geographic impact of Shi-Yung Chiou's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Shi-Yung Chiou with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Shi-Yung Chiou more than expected).

Fields of papers citing papers by Shi-Yung Chiou

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Shi-Yung Chiou. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Shi-Yung Chiou. The network helps show where Shi-Yung Chiou may publish in the future.

Co-authorship network of co-authors of Shi-Yung Chiou

This figure shows the co-authorship network connecting the top 25 collaborators of Shi-Yung Chiou. A scholar is included among the top collaborators of Shi-Yung Chiou based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Shi-Yung Chiou. Shi-Yung Chiou is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Ou, Shih‐Fu, et al.. (2014). Microstructures of TiN, TiAlN and TiAlVN coatings on AISI M2 steel deposited by magnetron reactive sputtering. Transactions of Nonferrous Metals Society of China. 24(8). 2559–2565. 26 indexed citations
2.
Chiou, Shi-Yung, et al.. (2013). Research on CBN/TiC composites Part1: Effects of the cBN content and sintering process on the hardness and transverse rupture strength. Ceramics International. 39(6). 7205–7210. 29 indexed citations
3.
Chiou, Shi-Yung, et al.. (2013). Development of electrically conductive zirconia Part1: The optimal process parameters and mechanical properties. Ceramics International. 39(5). 5705–5712. 5 indexed citations
4.
Chiou, Shi-Yung, et al.. (2012). Optimal Process Parameters for 3Y-TZP/TiN Conductive Polycrystal by Taguchi Method. Journal of Inorganic Materials. 27(5). 529–535. 3 indexed citations
5.
Ou, Shih‐Fu, Mao-Suan Huang, Shi-Yung Chiou, & Keng‐Liang Ou. (2012). Research of antibacterial activity on silver containing yttria-stabilized–zirconia bioceramic. Ceramics International. 39(4). 3591–3596. 24 indexed citations
6.
Ou, Shih‐Fu, Shi-Yung Chiou, & Keng‐Liang Ou. (2012). Phase transformation on hydroxyapatite decomposition. Ceramics International. 39(4). 3809–3816. 110 indexed citations
7.
Ou, Shih‐Fu, et al.. (2012). Research of phase transformation induced biodegradable properties on hydroxyapatite and tricalcium phosphate based bioceramic. Ceramics International. 39(2). 1455–1462. 31 indexed citations
8.
Gan, Dershin, et al.. (2011). Formation of Anatase and TiO from Ti Thin Film after Anodic Treatment and Thermal Annealing. Journal of The Electrochemical Society. 158(10). C319–C319. 16 indexed citations
9.
Cheng, Hsin-Chung, et al.. (2009). Enhancement of hemocompatibility on titanium implant with titanium-doped diamond-like carbon film evaluated by cellular reactions using bone marrow cell cultures in vitro. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 27(3). 1559–1565. 11 indexed citations
10.
Wang, Kuang‐Kuo, Dershin Gan, Ker‐Chang Hsieh, & Shi-Yung Chiou. (2009). The microstructure of η′-Cu6Sn5 and its orientation relationships with Cu in the early stage of growth. Thin Solid Films. 518(6). 1667–1674. 20 indexed citations
11.
Cheng, Hsin-Chung, et al.. (2008). Effect of plasma energy on enhancing biocompatibility and hemocompatibility of diamond-like carbon film with various titanium concentrations. Journal of Alloys and Compounds. 477(1-2). 931–935. 42 indexed citations
12.
Chiou, Shi-Yung & Dershin Gan. (2007). Interfacial mechanical properties of TiN coating on steels by indentation. Journal of Materials Science. 42(8). 2745–2752. 1 indexed citations
13.
Ou, Keng‐Liang, Wen-Fa Wu, & Shi-Yung Chiou. (2006). Enhancing the reliability of n+–p junction diodes using plasma treated tantalum barrier film. Microelectronic Engineering. 84(1). 151–160. 3 indexed citations
14.
Chen, I‐Ming, et al.. (2005). Condensation of tetragonal zirconia polycrystals by reactive sputtering. Thin Solid Films. 491(1-2). 339–346. 12 indexed citations
15.
Ou, Keng‐Liang, et al.. (2005). Barrier Capability of Hf-N Films with Various Nitrogen Concentrations Against Copper Diffusion in Cu/Hf-N/n[sup +]-p Junction Diodes. Journal of The Electrochemical Society. 152(2). G138–G138. 8 indexed citations
16.
Ou, Keng‐Liang, Ming-Hong Lin, & Shi-Yung Chiou. (2004). Nanostructured TaN(O)/TaN Barrier Film Formed by Oxygen Plasma Treatment for Copper Interconnect. Electrochemical and Solid-State Letters. 7(11). G272–G272. 5 indexed citations
17.
Lin, Ming‐Hong & Shi-Yung Chiou. (2004). Effect of Phase Formation Behavior on Thermal Stability of Hafnium-Based Thin Films for Copper Interconnects. Japanese Journal of Applied Physics. 43(6R). 3340–3340. 9 indexed citations
18.
Ou, Keng‐Liang, Shi-Yung Chiou, & Ming-Hong Lin. (2004). High Cu Diffusion Resistance in Ultrathin Multiquasi-amorphous CVD-Ti/TiN[sub x] Films. Journal of The Electrochemical Society. 151(11). G766–G766. 5 indexed citations
19.
Ou, Keng‐Liang, Ming‐Hung Tsai, Haw‐Ming Huang, et al.. (2004). Interfacial reactions and electrical properties of hafnium-based thin films in Cu/barrier/n+–p junction diodes. Microelectronic Engineering. 77(2). 184–192. 9 indexed citations
20.
Ou, Keng‐Liang, et al.. (2002). Improved TaN barrier layer against Cu diffusion by formation of an amorphous layer using plasma treatment. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 20(5). 2154–2161. 23 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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