Satyanarayan

567 total citations
32 papers, 454 citations indexed

About

Satyanarayan is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, Satyanarayan has authored 32 papers receiving a total of 454 indexed citations (citations by other indexed papers that have themselves been cited), including 22 papers in Electrical and Electronic Engineering, 20 papers in Mechanical Engineering and 7 papers in Mechanics of Materials. Recurrent topics in Satyanarayan's work include Electronic Packaging and Soldering Technologies (18 papers), 3D IC and TSV technologies (14 papers) and Advanced Welding Techniques Analysis (12 papers). Satyanarayan is often cited by papers focused on Electronic Packaging and Soldering Technologies (18 papers), 3D IC and TSV technologies (14 papers) and Advanced Welding Techniques Analysis (12 papers). Satyanarayan collaborates with scholars based in India, Nepal and Japan. Satyanarayan's co-authors include K. Narayan Prabhu, Kazuyuki Hokamoto, Akihisa Mori, Franklin R. Tay, Shigeru Tanaka, Nidambur Vasudev Ballal, R. Pinto, Masatoshi Nishi, A. Jayarama and Sunil Saumya and has published in prestigious journals such as International Journal of Hydrogen Energy, Materials Science and Engineering A and Advances in Colloid and Interface Science.

In The Last Decade

Satyanarayan

30 papers receiving 431 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Satyanarayan India 11 261 237 128 53 47 32 454
B. D. Vasyliv Ukraine 13 234 0.9× 83 0.4× 328 2.6× 43 0.8× 17 0.4× 58 469
Jiří Dluhoš Czechia 10 189 0.7× 105 0.4× 129 1.0× 110 2.1× 21 0.4× 24 364
G. Reumont France 11 221 0.8× 158 0.7× 246 1.9× 55 1.0× 17 0.4× 30 463
Hidekazu Sueyoshi Japan 12 357 1.4× 105 0.4× 230 1.8× 107 2.0× 7 0.1× 91 532
С. Н. Кулъков Russia 13 192 0.7× 38 0.2× 200 1.6× 76 1.4× 16 0.3× 88 447
L. Bourithis Greece 16 498 1.9× 89 0.4× 422 3.3× 311 5.9× 67 1.4× 23 719
Juno Gallego Brazil 13 305 1.2× 29 0.1× 237 1.9× 157 3.0× 37 0.8× 31 439
Susmit Datta India 10 222 0.9× 38 0.2× 302 2.4× 136 2.6× 30 0.6× 13 509
Gholam Hossein Borhani Iran 10 392 1.5× 26 0.1× 239 1.9× 112 2.1× 13 0.3× 29 534

Countries citing papers authored by Satyanarayan

Since Specialization
Citations

This map shows the geographic impact of Satyanarayan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Satyanarayan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Satyanarayan more than expected).

Fields of papers citing papers by Satyanarayan

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Satyanarayan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Satyanarayan. The network helps show where Satyanarayan may publish in the future.

Co-authorship network of co-authors of Satyanarayan

This figure shows the co-authorship network connecting the top 25 collaborators of Satyanarayan. A scholar is included among the top collaborators of Satyanarayan based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Satyanarayan. Satyanarayan is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Satyanarayan, et al.. (2025). Effect of casting moulds on grain morphology, mechanical and tribological properties of Sn–Cu alloy. Bulletin of Materials Science. 48(2).
2.
3.
Lokesha, V., et al.. (2023). Interpretable ensemble machine learning framework to predict wear rate of modified ZA-27 alloy. Tribology International. 188. 108783–108783. 21 indexed citations
4.
Satyanarayan, et al.. (2022). Study on thermal contact resistance of low melting alloy used as thermal interface material. Materials Today Proceedings. 66. 2508–2512. 2 indexed citations
5.
Jayarama, A., et al.. (2021). Role of UV irradiated Nafion in power enhancement of hydrogen fuel cells. International Journal of Hydrogen Energy. 46(50). 25596–25607. 10 indexed citations
6.
Rao, Arjun Sunil, et al.. (2020). Simulation and analysis of P(VDF-TrFE) cantilever-beams for low frequency applications. Materials Today Proceedings. 35. 392–395. 3 indexed citations
7.
Satyanarayan, et al.. (2020). Study on thermal resistance of brass with and without coating of metallic surface. Materials Today Proceedings. 35. 335–339. 1 indexed citations
8.
Satyanarayan, et al.. (2019). The Effect of Thermal Ageing on Solder/Substrate Interfacial Microstructures During Reflow of Sn–37Pb and Sn–3Ag–0.5Cu. Transactions of the Indian Institute of Metals. 72(6). 1545–1549. 3 indexed citations
9.
Satyanarayan, Akihisa Mori, Masatoshi Nishi, & Kazuyuki Hokamoto. (2018). Underwater shock wave weldability window for Sn-Cu plates. Journal of Materials Processing Technology. 267. 152–158. 21 indexed citations
10.
Satyanarayan, et al.. (2018). Effect of Sonication Time, Concentration, Shape and Size of Nano Particle on Thermal Conductivity of Al 2 O 3 /Water Nano Fluid. 3(17). 1 indexed citations
11.
Satyanarayan, Shigeru Tanaka, Akihisa Mori, & Kazuyuki Hokamoto. (2017). Welding of Sn and Cu plates using controlled underwater shock wave. Journal of Materials Processing Technology. 245. 300–308. 30 indexed citations
12.
Satyanarayan & K. Narayan Prabhu. (2015). Solder Joint Reliability of Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys Solidified on Copper Substrates with Different Surface Roughnesses. Materials science forum. 830-831. 265–269. 2 indexed citations
13.
Ballal, Nidambur Vasudev, et al.. (2013). Wettability of root canal sealers on intraradicular dentine treated with different irrigating solutions. Journal of Dentistry. 41(6). 556–560. 50 indexed citations
14.
Satyanarayan & K. Narayan Prabhu. (2013). Wetting behavior of lead-free solders on copper substrates. 3.31–3.31. 2 indexed citations
15.
Nayak, Vignesh, K. Narayan Prabhu, Nicole Stanford, & Satyanarayan. (2012). Wetting Behavior and Evolution of Microstructure of Sn–3.5Ag Solder Alloy on Electroplated 304 Stainless Steel Substrates. Transactions of the Indian Institute of Metals. 65(6). 713–717. 3 indexed citations
16.
Prabhu, K. Narayan, et al.. (2012). Effect of Purging Gas on Wetting Behavior of Sn-3.5Ag Lead-Free Solder on Nickel-Coated Aluminum Substrate. Journal of Materials Engineering and Performance. 22(3). 723–728. 8 indexed citations
17.
Satyanarayan & K. Narayan Prabhu. (2012). Wetting Characteristics of Sn-0.7Cu Lead-Free Solder Alloy on Copper Substrates. Materials science forum. 710. 569–574. 4 indexed citations
18.
Satyanarayan & K. Narayan Prabhu. (2011). Reactive wetting, evolution of interfacial and bulk IMCs and their effect on mechanical properties of eutectic Sn–Cu solder alloy. Advances in Colloid and Interface Science. 166(1-2). 87–118. 79 indexed citations
19.
Prabhu, K. Narayan, et al.. (2011). Effect of cooling rate during solidification of Sn–9Zn lead-free solder alloy on its microstructure, tensile strength and ductile–brittle transition temperature. Materials Science and Engineering A. 533. 64–70. 35 indexed citations
20.
Satyanarayan & K. Narayan Prabhu. (2010). Wetting Behaviour and Evolution of Microstructure of Sn–Ag–Zn Solders on Copper Substrates with Different Surface Textures. Journal of ASTM International. 7(9). 1–17. 4 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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