Michael Todd
- Biomedical Engineering top 10%
- Materials Chemistry
- Polymers and Plastics top 10%
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials
- Co-authors
- Frank G. ShiF.G. ShiMaurice E. EdwardsAndrew A. ShapiroLinda A. DomeierJack ZhangM. BuckleyK. R. Desai
- Topics
- Electronic Packaging and Soldering Technologies (12 papers)3D IC and TSV technologies (10 papers)Material Properties and Processing (5 papers)
- Journals
- Journal of Applied PhysicsTetrahedron LettersIEEE Transactions on Dielectrics and Electrical Insulation
- Partner nations
- United StatesGermany
In The Last Decade
Michael Todd
19 papers receiving 506 citations
Peers
Comparison fields: 5 of 51
- Biomedical Engineering 333
- Materials Chemistry 286
- Polymers and Plastics 173
- Electrical and Electronic Engineering 150
- Electronic, Optical and Magnetic Materials 105
Countries citing papers authored by Michael Todd
This map shows the geographic impact of Michael Todd's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Michael Todd with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Michael Todd more than expected).
Fields of papers citing papers by Michael Todd
This network shows the impact of papers produced by Michael Todd. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Michael Todd. The network helps show where Michael Todd may publish in the future.
Co-authorship network of co-authors of Michael Todd
This figure shows the co-authorship network connecting the top 25 collaborators of Michael Todd. A scholar is included among the top collaborators of Michael Todd based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Michael Todd. Michael Todd is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 3 | |
| 2 | 4 | |
| 3 | 17 | |
| 4 | 116 | |
| 5 | 1 | |
| 6 | Modeling and experimental study for the targeted design of dielectric properties of polymer composite materials | 2 |
| 7 | 2 | |
| 8 | 5 | |
| 9 | 3 | |
| 10 | 5 | |
| 11 | 5 | |
| 12 | 147 | |
| 13 | 63 | |
| 14 | 2 | |
| 15 | 11 | |
| 16 | 3 | |
| 17 | 65 | |
| 18 | 64 | |
| 19 | 22 |
About Michael Todd
Michael Todd is a scholar working on General Materials Science, Mechanics of Materials and Electrical and Electronic Engineering, having authored 19 papers that have together received 540 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (10 papers) and Material Properties and Processing (5 papers). The work is most often cited by research in Polymers and Plastics (173 citations), Biomedical Engineering (333 citations) and Materials Chemistry (286 citations). Michael Todd has collaborated with scholars based in United States and Germany. Frequent co-authors include Frank G. Shi, F.G. Shi, Maurice E. Edwards, Andrew A. Shapiro, Linda A. Domeier, Jack Zhang, M. Buckley, K. R. Desai and Fan Shi. Their work appears in journals such as Journal of Applied Physics, Tetrahedron Letters and IEEE Transactions on Dielectrics and Electrical Insulation.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.