Miaocao Wang

731 total citations · 1 hit paper
22 papers, 593 citations indexed

About

Miaocao Wang is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Materials Chemistry. According to data from OpenAlex, Miaocao Wang has authored 22 papers receiving a total of 593 indexed citations (citations by other indexed papers that have themselves been cited), including 11 papers in Electrical and Electronic Engineering, 11 papers in Biomedical Engineering and 11 papers in Materials Chemistry. Recurrent topics in Miaocao Wang's work include Advanced Surface Polishing Techniques (10 papers), Diamond and Carbon-based Materials Research (8 papers) and Electronic Packaging and Soldering Technologies (5 papers). Miaocao Wang is often cited by papers focused on Advanced Surface Polishing Techniques (10 papers), Diamond and Carbon-based Materials Research (8 papers) and Electronic Packaging and Soldering Technologies (5 papers). Miaocao Wang collaborates with scholars based in China, Singapore and Portugal. Miaocao Wang's co-authors include Fulong Zhu, Yixin Xu, Yuhua Huang, Chunsheng Shi, Xiang Zhang, Enzuo Liu, Chunnian He, Naiqin Zhao, Dong Lin and Sheng Liu and has published in prestigious journals such as Nature Communications, Applied Surface Science and Journal of Physics Condensed Matter.

In The Last Decade

Miaocao Wang

20 papers receiving 573 citations

Hit Papers

A powder-metallurgy-based strategy toward three-dimension... 2020 2026 2022 2024 2020 50 100 150 200 250

Peers

Miaocao Wang
Miaocao Wang
Citations per year, relative to Miaocao Wang Miaocao Wang (= 1×) peers Jianxiu Su

Countries citing papers authored by Miaocao Wang

Since Specialization
Citations

This map shows the geographic impact of Miaocao Wang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Miaocao Wang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Miaocao Wang more than expected).

Fields of papers citing papers by Miaocao Wang

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Miaocao Wang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Miaocao Wang. The network helps show where Miaocao Wang may publish in the future.

Co-authorship network of co-authors of Miaocao Wang

This figure shows the co-authorship network connecting the top 25 collaborators of Miaocao Wang. A scholar is included among the top collaborators of Miaocao Wang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Miaocao Wang. Miaocao Wang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Li, Jinming, Yixin Xu, Miaocao Wang, et al.. (2021). Deformation mechanism of copper reinforced by three-dimensional graphene under torsion and tension. Modelling and Simulation in Materials Science and Engineering. 30(2). 25004–25004. 5 indexed citations
2.
Huang, Yuhua, Miaocao Wang, Jinming Li, & Fulong Zhu. (2021). Effect of inclusion on 4H-SiC during nano-scratching from an atomistic perspective. Journal of Physics Condensed Matter. 33(43). 435402–435402. 18 indexed citations
3.
Wang, Miaocao, et al.. (2021). Investigation of the Turbulent Drag Reduction Mechanism of a Kind of Microstructure on Riblet Surface. Micromachines. 12(1). 59–59. 18 indexed citations
4.
Wang, Miaocao, Yuhua Huang, Jinming Li, Ling Xu, & Fulong Zhu. (2021). Local Stress Field in Wafer Thinning Simulations with Phase Space Averaging. Computers, materials & continua/Computers, materials & continua (Print). 68(1). 743–759.
5.
Huang, Yuhua, Miaocao Wang, Jinming Li, & Fulong Zhu. (2021). Effect of abrasive particle shape on the development of silicon substrate during nano-grinding. Computational Materials Science. 193. 110420–110420. 23 indexed citations
6.
Huang, Yuhua, Miaocao Wang, Jinming Li, & Fulong Zhu. (2021). Removal behavior of micropipe in 4H-SiC during micromachining. Journal of Manufacturing Processes. 68. 888–897. 14 indexed citations
7.
Zhang, Xiang, Yixin Xu, Miaocao Wang, et al.. (2020). A powder-metallurgy-based strategy toward three-dimensional graphene-like network for reinforcing copper matrix composites. Nature Communications. 11(1). 2775–2775. 268 indexed citations breakdown →
8.
Xu, Ling, et al.. (2020). Crack initiation and propagation mechanism of Al2O3-DBC substrate during thermal cycling test. Engineering Failure Analysis. 116. 104720–104720. 17 indexed citations
9.
Huang, Yuhua, Miaocao Wang, Yixin Xu, & Fulong Zhu. (2020). Investigation on gallium nitride with N-vacancy defect nano-grinding by molecular dynamics. Journal of Manufacturing Processes. 57. 153–162. 39 indexed citations
10.
Huang, Yuhua, Miaocao Wang, Yixin Xu, & Fulong Zhu. (2020). Investigation of vibration-assisted nano-grinding of gallium nitride via molecular dynamics. Materials Science in Semiconductor Processing. 121. 105372–105372. 48 indexed citations
11.
Xu, Yixin, et al.. (2019). A molecular dynamic study of nano-grinding of a monocrystalline copper-silicon substrate. Applied Surface Science. 493. 933–947. 53 indexed citations
13.
Xu, Yixin, et al.. (2018). Molecular Dynamics Simulation of GaN Nano-grinding. 468–472. 3 indexed citations
14.
Wang, Miaocao, Fulong Zhu, Yixin Xu, & Sheng Liu. (2018). Investigation of the differences in nanometric grinding of SiC and Si by molecular dynamics. 434–437. 3 indexed citations
15.
Wang, Miaocao, Fulong Zhu, Yixin Xu, & Sheng Liu. (2018). Investigation of Nanocutting Characteristics of Off-Axis 4H-SiC Substrate by Molecular Dynamics. Applied Sciences. 8(12). 2380–2380. 12 indexed citations
17.
Wang, Miaocao, et al.. (2016). Effect of Die Size and Die Tilt on Solder Reliability under Thermal Cycling. 1984–1989. 4 indexed citations
19.
Zhou, Yang, et al.. (2015). A new method for reducing warpage due to reflow in IGBT module. 1291–1295. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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