Kenji Hirohata

604 total citations
50 papers, 432 citations indexed

About

Kenji Hirohata is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Civil and Structural Engineering. According to data from OpenAlex, Kenji Hirohata has authored 50 papers receiving a total of 432 indexed citations (citations by other indexed papers that have themselves been cited), including 35 papers in Electrical and Electronic Engineering, 10 papers in Mechanical Engineering and 8 papers in Civil and Structural Engineering. Recurrent topics in Kenji Hirohata's work include Electronic Packaging and Soldering Technologies (27 papers), Silicon Carbide Semiconductor Technologies (9 papers) and Engineering Applied Research (7 papers). Kenji Hirohata is often cited by papers focused on Electronic Packaging and Soldering Technologies (27 papers), Silicon Carbide Semiconductor Technologies (9 papers) and Engineering Applied Research (7 papers). Kenji Hirohata collaborates with scholars based in Japan, Australia and South Korea. Kenji Hirohata's co-authors include Sophia Ananiadou, Naoaki Okazaki, Mitsuru Ishizuka, Yasuko Fujisawa, Takashi Kawakami, Brian Ko, Dennis T. L. Wong, James D. Cameron, Ian T. Meredith and Takuya Sakaguchi and has published in prestigious journals such as SHILAP Revista de lepidopterología, Journal of Applied Physics and Japanese Journal of Applied Physics.

In The Last Decade

Kenji Hirohata

43 papers receiving 419 citations

Peers

Kenji Hirohata
M. Dufour Canada
Haoming Lin China
Brian Howard United States
Faisal Amir Indonesia
Joachim Tabary France
Maheza Irna Mohamad Salim Malaysia
Qinwei Li China
Dirk Schäfer Germany
Martin R. Pfaller United States
Suyu Dong China
M. Dufour Canada
Kenji Hirohata
Citations per year, relative to Kenji Hirohata Kenji Hirohata (= 1×) peers M. Dufour

Countries citing papers authored by Kenji Hirohata

Since Specialization
Citations

This map shows the geographic impact of Kenji Hirohata's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Kenji Hirohata with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Kenji Hirohata more than expected).

Fields of papers citing papers by Kenji Hirohata

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Kenji Hirohata. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Kenji Hirohata. The network helps show where Kenji Hirohata may publish in the future.

Co-authorship network of co-authors of Kenji Hirohata

This figure shows the co-authorship network connecting the top 25 collaborators of Kenji Hirohata. A scholar is included among the top collaborators of Kenji Hirohata based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Kenji Hirohata. Kenji Hirohata is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Hirohata, Kenji, et al.. (2022). Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model. Journal of Electronic Packaging. 145(1). 1 indexed citations
2.
Ota, Chiharu, et al.. (2021). Phase field model of single Shockley stacking fault expansion in 4H-SiC PiN diode. Japanese Journal of Applied Physics. 60(2). 24004–24004. 3 indexed citations
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Takamoto, So, et al.. (2018). Development of a method to evaluate the stress distribution in 4H-SiC power devices. Japanese Journal of Applied Physics. 57(10). 106602–106602. 14 indexed citations
6.
Hirohata, Kenji, et al.. (2018). Prognostic Health Monitoring Method for Fatigue Failure of Solder Joints on Printed Circuit Boards Based on a Canary Circuit. Journal of Nondestructive Evaluation Diagnostics and Prognostics of Engineering Systems. 1(3). 31004–31004. 1 indexed citations
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Ko, Brian, James D. Cameron, Ravi Kiran Munnur, et al.. (2016). Noninvasive CT-Derived FFR Based on Structural and Fluid Analysis. JACC. Cardiovascular imaging. 10(6). 663–673. 151 indexed citations
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Hirohata, Kenji, et al.. (2010). Health-monitoring method of note PC for cooling performance degradation and load assessment. Microelectronics Reliability. 51(2). 255–262. 9 indexed citations
12.
Hirohata, Kenji, et al.. (2009). Categorized Application Technology of Numerical Simulation on Electronic Equipment Thermal Design. 247–252. 1 indexed citations
13.
Hirohata, Kenji, Naoaki Okazaki, Sophia Ananiadou, & Mitsuru Ishizuka. (2008). Identifying Sections in Scientific Abstracts using Conditional Random Fields. Research Explorer (The University of Manchester). 381–388. 100 indexed citations
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Hirohata, Kenji, et al.. (2006). Damage Path Simulation of Solder Joints. TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A. 72(721). 1364–1369. 8 indexed citations
16.
Hirohata, Kenji, et al.. (2005). Damage Path Simulation of Solder Joints in QFP. 1215–1221. 10 indexed citations
17.
Hirohata, Kenji, et al.. (2004). Multidisciplinary Reliability Design of Electronics Packaging. 10th AIAA/ISSMO Multidisciplinary Analysis and Optimization Conference. 1 indexed citations
18.
Hirohata, Kenji, et al.. (2002). Mechanical fatigue test method for chip/underfill delamination in flip-chip packages. IEEE Transactions on Electronics Packaging Manufacturing. 25(3). 217–222. 18 indexed citations
19.
Hirohata, Kenji, et al.. (2001). Proposal for Structural Reliability Design Method Based on Response Surface Methodology and Bayes Theory.. TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A. 67(660). 1297–1304. 1 indexed citations
20.
Hirohata, Kenji, et al.. (1997). Adhesive Strength Integrity Evaluation of Resin Encapsulated Semiconductor Package.. 12(6). 429–435. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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