J.M. Park

679 total citations
23 papers, 356 citations indexed

About

J.M. Park is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Materials Chemistry. According to data from OpenAlex, J.M. Park has authored 23 papers receiving a total of 356 indexed citations (citations by other indexed papers that have themselves been cited), including 10 papers in Mechanical Engineering, 9 papers in Electrical and Electronic Engineering and 9 papers in Materials Chemistry. Recurrent topics in J.M. Park's work include Electronic Packaging and Soldering Technologies (5 papers), Aluminum Alloys Composites Properties (5 papers) and Metallic Glasses and Amorphous Alloys (4 papers). J.M. Park is often cited by papers focused on Electronic Packaging and Soldering Technologies (5 papers), Aluminum Alloys Composites Properties (5 papers) and Metallic Glasses and Amorphous Alloys (4 papers). J.M. Park collaborates with scholars based in South Korea, Austria and United States. J.M. Park's co-authors include Jeong Tae Kim, Sung Hwan Hong, C.E. Park, Sehoon Oh, K.B. Kim, Hae Jin Park, J. Eckert, K. Cho, Jin‐Yoo Suh and J.K. Kim and has published in prestigious journals such as ACS Applied Materials & Interfaces, Polymer and Journal of Alloys and Compounds.

In The Last Decade

J.M. Park

22 papers receiving 345 citations

Peers

J.M. Park

EEE

Ruixuan Tan China

Dongyu He China

A. Ismail Malaysia

Yongfang Huang China

Yongpeng Wu China

Uğur Gökmen Türkiye

A. Rajendra India

S. Savoie Canada

Alice Lassnig Austria

Ruixuan Tan China

J.M. Park

99 ×0.4

163 ×1.1

69 ×0.8

EEE

29 ×0.5

33 ×0.6

Citations per year, relative to J.M. Park J.M. Park (= 1×) peers Ruixuan Tan

Countries citing papers authored by J.M. Park

Since Specialization

Citations

This map shows the geographic impact of J.M. Park's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J.M. Park with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J.M. Park more than expected).

Fields of papers citing papers by J.M. Park

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by J.M. Park. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J.M. Park. The network helps show where J.M. Park may publish in the future.

Co-authorship network of co-authors of J.M. Park

This figure shows the co-authorship network connecting the top 25 collaborators of J.M. Park. A scholar is included among the top collaborators of J.M. Park based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with J.M. Park. J.M. Park is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

Park, J.M., et al.. (2025). (IE&EE Student Achievement Award) Strategies for Sustainable Ethylene, Ethanol, and Acetate via Electrochemical CO₂ Reduction. ECS Meeting Abstracts. MA2025-01(41). 2186–2186. 1 indexed citations

Park, J.M., et al.. (2025). Highly Selective Electrolytic Reduction of CO₂ to Ethylene. ACS Applied Energy Materials. 8(18). 13607–13619. 1 indexed citations

Park, J.M., et al.. (2024). The Future of Die-to-Die Copper Interconnects and Epoxy Dielectrics. ECS Meeting Abstracts. MA2024-02(23). 1974–1974.

Park, J.M., et al.. (2024). Fundamental Insights into Copper-Epoxy Interfaces for High-Frequency Chip-to-Chip Interconnects. ACS Applied Materials & Interfaces. 17(1). 2480–2490. 1 indexed citations

Park, J.M., et al.. (2024). Extending Copper Interconnects and Epoxy Dielectrics to Multi-GHz Frequencies. IEEE Transactions on Components Packaging and Manufacturing Technology. 14(6). 984–992. 1 indexed citations

Park, J.M., et al.. (2024). pH Effects in the Electrochemical Reduction of CO at Cu Electrocatalysts in an MEA Cell Configuration. ECS Meeting Abstracts. MA2024-01(37). 2201–2201. 1 indexed citations

Kim, Jeong Tae, Sung Hwan Hong, Hae Jin Park, et al.. (2015). Influence of microstructural evolution on mechanical behavior of Fe–Nb–B ultrafine composites with a correlation to elastic modulus and hardness. Journal of Alloys and Compounds. 647. 886–891. 26 indexed citations

Park, J.M., et al.. (2014). Internal structural evolution and enhanced tensile plasticity of Ti-based bulk metallic glass and composite via cold rolling. Journal of Alloys and Compounds. 615. S113–S117. 30 indexed citations

Park, Hae Jin, Sung Hwan Hong, Jeong Tae Kim, et al.. (2014). Characterization and deformation behavior of Ti hybrid compacts with solid-to-porous gradient structure. Materials & Design (1980-2015). 60. 66–71. 18 indexed citations

10.

Hong, Sung Hwan, Jeong Tae Kim, Hae Jin Park, et al.. (2014). Phase transformation and mechanical properties of as-cast Ti41.5Zr41.5Ni17 quasicrystalline composites. Journal of Non-Crystalline Solids. 392-393. 6–10. 2 indexed citations

11.

Hong, Sung Hwan, Jeong Tae Kim, Hae Jin Park, et al.. (2014). Chemical heterogeneity-induced plasticity in Ti–Fe–Bi ultrafine eutectic alloys. Materials & Design (1980-2015). 60. 363–367. 23 indexed citations

12.

Kim, Jeong Tae, et al.. (2013). Plastic deformation behavior of Fe–Co–B–Si–Nb–Cr bulk metallic glasses under nanoindentation. Journal of Alloys and Compounds. 587. 415–419. 29 indexed citations

13.

Sohn, Sangho, et al.. (2012). Microalloying effect on the microstructure and mechanical properties in Al–Cu based dendrite-ultrafine composites. Journal of Alloys and Compounds. 541. 14–17. 4 indexed citations

14.

Park, J.M., et al.. (2005). Evolution of a CMOS Based Lateral High Voltage Technology Concept. Microelectronics Journal. 37(3). 243–248. 7 indexed citations

15.

Kim, H.S., D.H. Kim, J.M. Park, et al.. (2004). An outstanding and highly manufacturable 80nm DRAM technology. 17.2.1–17.2.4. 9 indexed citations

16.

Park, C.E., et al.. (1998). Adhesion improvement of epoxy resin/copper lead frame j oints by azole compounds. Journal of Adhesion Science and Technology. 12(5). 541–561. 30 indexed citations

17.

Park, C.E., et al.. (1997). Adhesion improvement of epoxy resin to alloy 42 lead frame by silane coupling agents. Journal of Adhesion Science and Technology. 11(6). 797–809. 12 indexed citations

18.

Cho, K., et al.. (1997). Effects of plasma treatment of polyimide on the adhesion strength of epoxy resin / polyimide j oints. Journal of Adhesion Science and Technology. 11(1). 95–104. 27 indexed citations

19.

Cho, K., et al.. (1997). Adhesion improvement of epoxy resin/polyimide joints by amine treatment of polyimide surface. Polymer. 38(4). 827–834. 39 indexed citations

20.

Cho, K., et al.. (1994). Effects of the imidization temperature of poly(imide-siloxane) on the adhesion strength of epoxy resin/poly(imide-siloxane) joints. Journal of Adhesion Science and Technology. 8(12). 1395–1411. 7 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact