Jing Wan

469 total citations
17 papers, 341 citations indexed

About

Jing Wan is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Economics and Econometrics. According to data from OpenAlex, Jing Wan has authored 17 papers receiving a total of 341 indexed citations (citations by other indexed papers that have themselves been cited), including 5 papers in Mechanical Engineering, 5 papers in Electrical and Electronic Engineering and 3 papers in Economics and Econometrics. Recurrent topics in Jing Wan's work include Electronic Packaging and Soldering Technologies (5 papers), 3D IC and TSV technologies (5 papers) and Intermetallics and Advanced Alloy Properties (3 papers). Jing Wan is often cited by papers focused on Electronic Packaging and Soldering Technologies (5 papers), 3D IC and TSV technologies (5 papers) and Intermetallics and Advanced Alloy Properties (3 papers). Jing Wan collaborates with scholars based in China, Australia and Canada. Jing Wan's co-authors include Yonglin Ren, Simon McKirdy, Wei Chen, Y.C. Liu, Guojun Qi, Changyou Li, Kai Yang, Yu Xi, Bin Zhang and Wanqiang Qian and has published in prestigious journals such as Journal of Alloys and Compounds, European Journal of Marketing and European Economic Review.

In The Last Decade

Jing Wan

17 papers receiving 335 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Jing Wan China 8 144 143 102 95 83 17 341
Yuanchen Zhang China 12 148 1.0× 115 0.8× 116 1.1× 11 0.1× 6 0.1× 32 381
Yan Dong China 11 92 0.6× 104 0.7× 46 0.5× 15 0.2× 16 0.2× 37 370
F. J. Madrid Canada 8 139 1.0× 96 0.7× 161 1.6× 36 0.4× 3 0.0× 15 333
A. Scaltsoyiannes Greece 12 26 0.2× 156 1.1× 163 1.6× 7 0.1× 11 0.1× 29 365
Zongbo Li China 13 82 0.6× 192 1.3× 144 1.4× 15 0.2× 11 0.1× 37 479
Ki–Jeong Hong South Korea 12 254 1.8× 45 0.3× 149 1.5× 13 0.1× 17 0.2× 69 424
Po‐An Lin Taiwan 14 219 1.5× 70 0.5× 260 2.5× 119 1.3× 1 0.0× 25 488
Cheng‐Lung Tsai Taiwan 9 80 0.6× 150 1.0× 83 0.8× 9 0.1× 12 0.1× 28 331
Jingrui Sun China 12 273 1.9× 80 0.6× 194 1.9× 11 0.1× 16 0.2× 34 411
Takuro Ito Japan 11 27 0.2× 85 0.6× 66 0.6× 5 0.1× 14 0.2× 40 315

Countries citing papers authored by Jing Wan

Since Specialization
Citations

This map shows the geographic impact of Jing Wan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jing Wan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jing Wan more than expected).

Fields of papers citing papers by Jing Wan

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Jing Wan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jing Wan. The network helps show where Jing Wan may publish in the future.

Co-authorship network of co-authors of Jing Wan

This figure shows the co-authorship network connecting the top 25 collaborators of Jing Wan. A scholar is included among the top collaborators of Jing Wan based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Jing Wan. Jing Wan is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

17 of 17 papers shown
1.
Wan, Jing & Pankaj Aggarwal. (2024). A second life for second-hand products: the role of anthropomorphism and taboo trade-offs. European Journal of Marketing. 58(13). 184–204. 1 indexed citations
2.
Wan, Jing, Cong Huang, Changyou Li, et al.. (2021). Biology, invasion and management of the agricultural invader: Fall armyworm, Spodoptera frugiperda (Lepidoptera: Noctuidae). Journal of Integrative Agriculture. 20(3). 646–663. 139 indexed citations
3.
Qi, Guojun, Jian Ma, Jing Wan, et al.. (2021). Source Regions of the First Immigration of Fall Armyworm, Spodoptera frugiperda (Lepidoptera: Noctuidae) Invading Australia. Insects. 12(12). 1104–1104. 32 indexed citations
4.
Wan, Jing & Jie Zhang. (2020). Optimal growth through innovation, investment, and labor. European Economic Review. 132. 103644–103644. 4 indexed citations
5.
Wan, Jing, et al.. (2020). Industry-Classification Analysis of Provincial Final Energy Consumption Structure in China. 863–868. 1 indexed citations
6.
Wan, Jing, Rui Wang, Yonglin Ren, & Simon McKirdy. (2020). Potential Distribution and the Risks of Bactericera cockerelli and Its Associated Plant Pathogen Candidatus Liberibacter Solanacearum for Global Potato Production. Insects. 11(5). 298–298. 17 indexed citations
7.
8.
Wan, Jing & Shenghao Zhu. (2017). Bequests, estate taxes, and wealth distributions. Economic Theory. 67(1). 179–210. 6 indexed citations
9.
Zhang, Shen & Jing Wan. (2017). Do China’s Shadow Banking Interest Rates Capture Its Monetary Policy Stance?. Emerging Markets Finance and Trade. 53(12). 2686–2695. 4 indexed citations
10.
Tong, Sarah Y. & Jing Wan. (2017). China's Economy in Transformation under the New Normal. 3 indexed citations
11.
Tong, Sarah Y. & Jing Wan. (2016). China’s Supply-Side Reform: The Rationale and Implications. East Asian Policy. 8(4). 44–54. 2 indexed citations
12.
Wan, Jing. (2016). China’s Stock Market Turmoil: Lessons and Implications. East Asian Policy. 8(2). 94–102. 2 indexed citations
13.
Chen, Wei, Yi Liu, & Jing Wan. (2008). Formation of interfacial structure of Sn–3.7Ag–0.9Zn eutectic solder with different Al additions. Journal of Materials Science Materials in Electronics. 20(9). 861–866. 5 indexed citations
14.
Wan, Jing, et al.. (2007). Effect of Al content on the formation of intermetallic compounds in Sn–Ag–Zn lead-free solder. Journal of Materials Science Materials in Electronics. 19(3). 247–253. 16 indexed citations
15.
Wan, Jing, et al.. (2007). Effect of the soldering time on the formation of interfacial structure between Sn–Ag–Zn lead-free solder and Cu substrate. Journal of Materials Science Materials in Electronics. 19(12). 1160–1168. 14 indexed citations
16.
Chen, Wei, et al.. (2007). Microstructures of eutectic Sn–Ag–Zn solder solidified with different cooling rates. Journal of Alloys and Compounds. 464(1-2). 301–305. 42 indexed citations
17.
Liu, Y.C., Jing Wan, & Zhiming Gao. (2007). Intermediate decomposition of metastable Cu5Zn8 phase in the soldered Sn–Ag–Zn/Cu interface. Journal of Alloys and Compounds. 465(1-2). 205–209. 22 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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