J.G. Duh

1.1k total citations
42 papers, 954 citations indexed

About

J.G. Duh is a scholar working on Materials Chemistry, Electrical and Electronic Engineering and Mechanics of Materials. According to data from OpenAlex, J.G. Duh has authored 42 papers receiving a total of 954 indexed citations (citations by other indexed papers that have themselves been cited), including 19 papers in Materials Chemistry, 18 papers in Electrical and Electronic Engineering and 13 papers in Mechanics of Materials. Recurrent topics in J.G. Duh's work include Metal and Thin Film Mechanics (13 papers), Corrosion Behavior and Inhibition (9 papers) and Electrodeposition and Electroless Coatings (6 papers). J.G. Duh is often cited by papers focused on Metal and Thin Film Mechanics (13 papers), Corrosion Behavior and Inhibition (9 papers) and Electrodeposition and Electroless Coatings (6 papers). J.G. Duh collaborates with scholars based in Taiwan, Hong Kong and United States. J.G. Duh's co-authors include Cheng-Han Lin, S.R. Sheen, Jien‐Wei Yeh, Chiuhsiang Joe Lin, P. Y. Liao, Sien Chi, Su-Yueh Tsai, Julin Wan, F. C. Tai and J.C. Huang and has published in prestigious journals such as Journal of Applied Physics, Journal of The Electrochemical Society and Journal of Power Sources.

In The Last Decade

J.G. Duh

40 papers receiving 926 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
J.G. Duh Taiwan 19 495 423 327 319 155 42 954
Min Tae Kim South Korea 16 398 0.8× 276 0.7× 412 1.3× 237 0.7× 94 0.6× 51 935
Danick Gallant Canada 15 444 0.9× 247 0.6× 204 0.6× 281 0.9× 56 0.4× 24 1000
J.‐P. Celis Belgium 15 661 1.3× 454 1.1× 274 0.8× 360 1.1× 84 0.5× 34 1.0k
Keesam Shin South Korea 18 581 1.2× 308 0.7× 785 2.4× 306 1.0× 102 0.7× 105 1.4k
Rasool Amini Iran 21 695 1.4× 337 0.8× 684 2.1× 168 0.5× 113 0.7× 46 1.2k
A. Jyothirmayi India 22 576 1.2× 374 0.9× 487 1.5× 215 0.7× 305 2.0× 42 1.3k
K. Rożniatowski Poland 15 456 0.9× 166 0.4× 408 1.2× 118 0.4× 148 1.0× 47 895
S. Dallek United States 15 541 1.1× 252 0.6× 511 1.6× 106 0.3× 61 0.4× 29 931
Chuen-Guang Chao Taiwan 19 467 0.9× 172 0.4× 668 2.0× 146 0.5× 76 0.5× 65 983
Arvin Taghizadeh Tabrizi Iran 17 381 0.8× 205 0.5× 426 1.3× 259 0.8× 78 0.5× 44 795

Countries citing papers authored by J.G. Duh

Since Specialization
Citations

This map shows the geographic impact of J.G. Duh's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J.G. Duh with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J.G. Duh more than expected).

Fields of papers citing papers by J.G. Duh

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by J.G. Duh. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J.G. Duh. The network helps show where J.G. Duh may publish in the future.

Co-authorship network of co-authors of J.G. Duh

This figure shows the co-authorship network connecting the top 25 collaborators of J.G. Duh. A scholar is included among the top collaborators of J.G. Duh based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with J.G. Duh. J.G. Duh is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Kevorkyants, R., et al.. (2022). Tunable oxygen-vacancy mediated NiCo2O4 microspheres coupled by holey graphene framework with superior lithium-ion storage properties. Materials Chemistry and Physics. 292. 126876–126876. 2 indexed citations
2.
Huang, J.C., et al.. (2021). Self-template fabrication of multi-scaled ZnFe2O4 microspheres and their excellent lithium-ion storage properties. Journal of Alloys and Compounds. 862. 158342–158342. 19 indexed citations
3.
Chang, Yen‐Chung, Shih‐Nan Hsiao, Kuo‐Feng Chiu, et al.. (2015). Effect of L12 ordering in antiferromagnetic Ir-Mn epitaxial layer on exchange bias of FePd films. Journal of Applied Physics. 117(17). 1 indexed citations
4.
Tsai, Shih‐Chin & J.G. Duh. (2010). Microstructure and Corrosion Properties of Multilayered CrAlN/SiN[sub x] Coatings. Journal of The Electrochemical Society. 157(5). K89–K89. 10 indexed citations
5.
Duh, J.G., et al.. (2009). Microstructure and mechanical properties of CrAlN/SiN nanostructure multilayered coatings. Thin Solid Films. 518(5). 1480–1483. 24 indexed citations
6.
Lin, Cheng-Han & J.G. Duh. (2009). Electrochemical impedance spectroscopy (EIS) study on corrosion performance of CrAlSiN coated steels in 3.5wt.% NaCl solution. Surface and Coatings Technology. 204(6-7). 784–787. 84 indexed citations
7.
Tai, F. C., et al.. (2009). Application of electroless Ni–Zn–P film for under-bump metallization on solder joint. Scripta Materialia. 61(7). 748–751. 34 indexed citations
8.
Duh, J.G., et al.. (2008). The effects of repeated heat‐pressing on properties of pressable glass‐ceramics. Journal of Oral Rehabilitation. 36(2). 132–141. 25 indexed citations
9.
Lin, Cheng-Han & J.G. Duh. (2008). Corrosion behavior of (Ti–Al–Cr–Si–V)xNy coatings on mild steels derived from RF magnetron sputtering. Surface and Coatings Technology. 203(5-7). 558–561. 64 indexed citations
10.
Duh, J.G., et al.. (2008). Decapsulation Method for Flip Chips with Ceramics in Microelectronic Packaging. Journal of Electronic Materials. 37(6). 845–851. 6 indexed citations
11.
Liao, P. Y., J.G. Duh, & Hwo‐Shuenn Sheu. (2007). In Situ Synchrotron X-Ray Studies of LiNi[sub 1−x−y]Co[sub y]Mn[sub x]O[sub 2] Cathode Materials. Electrochemical and Solid-State Letters. 10(4). A88–A88. 12 indexed citations
12.
13.
Duh, J.G., et al.. (2001). Microstructural evolution in the Sn-Cu-Ni and Pb-Sn solder joints with Cu and Pt-Ag metallized Al2O3 substrate. Journal of Electronic Materials. 30(9). 1241–1248. 14 indexed citations
14.
Lin, Chiuhsiang Joe & J.G. Duh. (1995). Fretting and scratch wear characteristics of coloured films on stainless steel obtained by the current pulse method. Surface and Coatings Technology. 73(1-2). 52–59. 10 indexed citations
15.
Tse, W. S., et al.. (1994). Raman Spectra of Titanium Nitride Thin Films. Chinese Journal of Physics. 32(2). 205–210. 38 indexed citations
16.
Duh, J.G., et al.. (1993). Effects of pH values in electroless Ni plating on mild steel with TiN coating. Surface and Coatings Technology. 58(1). 19–28. 6 indexed citations
17.
Duh, J.G., et al.. (1993). Morphology and adhesion strength in electroless Cu metallized AlN substrate. IEEE Transactions on Components Hybrids and Manufacturing Technology. 16(8). 1012–1020. 16 indexed citations
18.
Duh, J.G. & Julin Wan. (1992). Developments in highly toughened CeO2-Y2O3-ZrO2 ceramic system. Journal of Materials Science. 27(22). 6197–6203. 26 indexed citations
19.
Duh, J.G., et al.. (1992). Knoop hardness and adhesion strength in Ti interlayer modified TiN coating on 1008 carbon steel. Materials Chemistry and Physics. 32(4). 352–360. 1 indexed citations
20.
Duh, J.G., et al.. (1989). Interfacial morphology and pre-oxidation effect in dental alloy/opaque bonding. Journal of Materials Science Letters. 8(3). 355–357. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

Rankless by CCL
2026