Hong-Shin Jun
- Electrical and Electronic Engineering
- Hardware and Architecture top 5%
- Computer Networks and Communications top 10%
- Biomedical Engineering
- Electronic, Optical and Magnetic Materials
- Topics
- VLSI and Analog Circuit Testing (5 papers)3D IC and TSV technologies (4 papers)Integrated Circuits and Semiconductor Failure Analysis (3 papers)
- Cited by
- Hardware and ArchitectureComputer Networks and CommunicationsElectrical and Electronic Engineering
- Journals
- Electronics LettersIEEE Transactions on Very Large Scale Integration (VLSI) Systemsphysica status solidi (a)
- Partner nations
- South KoreaUnited StatesChina
In The Last Decade
Hong-Shin Jun
11 papers receiving 269 citations
Peers
Comparison fields: 5 of 40
- Electrical and Electronic Engineering 155
- Hardware and Architecture 129
- Computer Networks and Communications 76
- Biomedical Engineering 41
- Electronic, Optical and Magnetic Materials 27
Countries citing papers authored by Hong-Shin Jun
This map shows the geographic impact of Hong-Shin Jun's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Hong-Shin Jun with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Hong-Shin Jun more than expected).
Fields of papers citing papers by Hong-Shin Jun
This network shows the impact of papers produced by Hong-Shin Jun. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Hong-Shin Jun. The network helps show where Hong-Shin Jun may publish in the future.
Co-authorship network of co-authors of Hong-Shin Jun
This figure shows the co-authorship network connecting the top 25 collaborators of Hong-Shin Jun. A scholar is included among the top collaborators of Hong-Shin Jun based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Hong-Shin Jun. Hong-Shin Jun is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 143 | |
| 2 | 23 | |
| 3 | 7 | |
| 4 | 1 | |
| 5 | 7 | |
| 6 | 27 | |
| 7 | 34 | |
| 8 | 11 | |
| 9 | 0 | |
| 10 | 1 | |
| 11 | 11 | |
| 12 | 20 |
About Hong-Shin Jun
Hong-Shin Jun is a scholar working on Hardware and Architecture, Automotive Engineering and Electrical and Electronic Engineering, having authored 12 papers that have together received 285 indexed citations. Recurring topics across this work include VLSI and Analog Circuit Testing (5 papers), 3D IC and TSV technologies (4 papers) and Integrated Circuits and Semiconductor Failure Analysis (3 papers). The work is most often cited by research in Hardware and Architecture (129 citations), Computer Networks and Communications (76 citations) and Electrical and Electronic Engineering (155 citations). Hong-Shin Jun has collaborated with scholars based in South Korea, United States and China. Frequent co-authors include Jin-Hee Cho, Keith Kim, Hwa–Young Son, Xinli Gu, Jae Jin Lee, Dae San Kim, Rong Fang, Zhiyuan Wang, Jeung‐hyun Jeong and Seokhyun Yoon. Their work appears in journals such as Electronics Letters, IEEE Transactions on Very Large Scale Integration (VLSI) Systems and physica status solidi (a).
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.