Guoping Du

3.7k total citations
117 papers, 3.2k citations indexed

About

Guoping Du is a scholar working on Materials Chemistry, Electrical and Electronic Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Guoping Du has authored 117 papers receiving a total of 3.2k indexed citations (citations by other indexed papers that have themselves been cited), including 83 papers in Materials Chemistry, 61 papers in Electrical and Electronic Engineering and 28 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Guoping Du's work include Luminescence Properties of Advanced Materials (23 papers), Supercapacitor Materials and Fabrication (17 papers) and Advanced battery technologies research (16 papers). Guoping Du is often cited by papers focused on Luminescence Properties of Advanced Materials (23 papers), Supercapacitor Materials and Fabrication (17 papers) and Advanced battery technologies research (16 papers). Guoping Du collaborates with scholars based in China, United States and Hong Kong. Guoping Du's co-authors include Nan Chen, Nan Chen, Yong Hu, Xiaoliang Zeng, Rong Sun, Fang Xu, Wang Li, Nan Chen, Ching‐Ping Wong and Linlin Ren and has published in prestigious journals such as SHILAP Revista de lepidopterología, ACS Nano and Chemistry of Materials.

In The Last Decade

Guoping Du

116 papers receiving 3.1k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Guoping Du China 33 2.2k 1.2k 822 621 467 117 3.2k
Amir Pakdel Japan 32 3.5k 1.6× 1.4k 1.1× 573 0.7× 740 1.2× 431 0.9× 68 4.7k
Indranil Lahiri India 26 2.6k 1.2× 1.5k 1.3× 868 1.1× 1.2k 1.9× 494 1.1× 87 4.0k
X.B. Zhang China 29 1.5k 0.7× 1.4k 1.2× 1.1k 1.3× 474 0.8× 458 1.0× 48 2.8k
Yuchi Fan China 37 2.4k 1.1× 1.4k 1.1× 1.2k 1.4× 733 1.2× 1.2k 2.5× 107 4.5k
Zhongqi Shi China 35 2.8k 1.3× 1.7k 1.4× 739 0.9× 774 1.2× 1.2k 2.5× 173 4.6k
Jianbing Zang China 36 1.4k 0.6× 2.1k 1.7× 758 0.9× 382 0.6× 735 1.6× 174 3.8k
Moustafa A. Darwish Egypt 32 2.1k 1.0× 1.3k 1.0× 1.4k 1.7× 502 0.8× 340 0.7× 102 3.2k
Dah‐Shyang Tsai Taiwan 33 1.8k 0.9× 1.7k 1.4× 871 1.1× 373 0.6× 340 0.7× 149 3.4k
Hsing‐I Hsiang Taiwan 28 2.1k 1.0× 1.3k 1.1× 939 1.1× 383 0.6× 451 1.0× 186 2.9k

Countries citing papers authored by Guoping Du

Since Specialization
Citations

This map shows the geographic impact of Guoping Du's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Guoping Du with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Guoping Du more than expected).

Fields of papers citing papers by Guoping Du

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Guoping Du. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Guoping Du. The network helps show where Guoping Du may publish in the future.

Co-authorship network of co-authors of Guoping Du

This figure shows the co-authorship network connecting the top 25 collaborators of Guoping Du. A scholar is included among the top collaborators of Guoping Du based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Guoping Du. Guoping Du is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Fan, Jianfeng, Yu Zhou, Xiangliang Zeng, et al.. (2024). High damping, soft and reprocessable thermal interface materials inspired by the microstructure of skin tissue. Composites Science and Technology. 247. 110428–110428. 12 indexed citations
2.
Cao, Wei, et al.. (2023). Etching-induced ion exchange engineering of two-dimensional layered NiFeCo-based hydroxides for high energy charge storage. Dalton Transactions. 53(3). 1295–1306. 8 indexed citations
3.
Zeng, Xiangliang, et al.. (2023). Damping, soft, and thermally conductive composite elastomer via introducing bottlebrush chains. Chemical Engineering Journal. 474. 145847–145847. 22 indexed citations
4.
Zeng, Qiong, et al.. (2023). In situ electrochemical rapid growth NiCo-LDH as a high-performance electrode material for all-solid-state flexible hybrid supercapacitors. Journal of Energy Storage. 67. 107618–107618. 10 indexed citations
5.
Xu, Fang, Guoping Du, & Nan Chen. (2023). Composition engineering strategy of carbon–coated bimetallic phosphide for high energy density hybrid supercapacitors. Journal of Alloys and Compounds. 961. 170900–170900. 6 indexed citations
6.
Li, Junwei, Zhenqiang Ye, Yunsong Pang, et al.. (2023). Compliance-tunable thermal interface materials based on vertically oriented carbon fiber arrays for high-performance thermal management. Composites Science and Technology. 234. 109948–109948. 49 indexed citations
7.
Fan, Jianfeng, Xiangliang Zeng, Linlin Ren, et al.. (2022). High thermal conductivity and remarkable damping composite gels as thermal interface materials for heat dissipation of chip. SHILAP Revista de lepidopterología. 1(2). 100013–100013. 38 indexed citations
8.
Wang, Zhenyu, Xiangliang Zeng, Jianfeng Fan, et al.. (2022). Interfacial Coordination Interaction Enables Soft Elastomer Composites High Thermal Conductivity and High Toughness. ACS Applied Materials & Interfaces. 14(29). 33912–33921. 28 indexed citations
9.
Li, Junwei, Yuexing Zhang, Ting Liang, et al.. (2021). Thermal Interface Materials with Both High Through-Plane Thermal Conductivity and Excellent Elastic Compliance. Chemistry of Materials. 33(22). 8926–8937. 61 indexed citations
10.
Zhang, Yafang, Juhua Huang, Ming Cao, et al.. (2021). Preparation of Boron Nitride and Silicone Rubber Composite Material for Application in Lithium Batteries. Energies. 14(4). 999–999. 16 indexed citations
11.
Wang, Qian, et al.. (2021). Cohesion properties and fracture toughness of Fe/W interfaces with additions of Re and Cr. Vacuum. 195. 110703–110703. 8 indexed citations
12.
Zeng, Yu, et al.. (2021). Structural, dielectric and mechanical behaviors of (La, Nb) Co-doped TiO2/Silicone rubber composites. Ceramics International. 47(16). 22365–22372. 24 indexed citations
13.
Zeng, Xiangliang, Linlin Ren, Jin‐Qi Xie, et al.. (2019). Room-Temperature Welding of Silver Telluride Nanowires for High-Performance Thermoelectric Film. ACS Applied Materials & Interfaces. 11(41). 37892–37900. 40 indexed citations
14.
Wang, Mingmei, Tao Zhang, Dasha Mao, et al.. (2019). Highly Compressive Boron Nitride Nanotube Aerogels Reinforced with Reduced Graphene Oxide. ACS Nano. 13(7). 7402–7409. 145 indexed citations
15.
Fang, Yihang, Nan Chen, Guoping Du, et al.. (2019). High-temperature oxidation resistance, mechanical and wear resistance properties of Ti(C,N)-based cermets with Al0.3CoCrFeNi high-entropy alloy as a metal binder. Journal of Alloys and Compounds. 815. 152486–152486. 79 indexed citations
16.
Kang, Jiahui, Jiali Sheng, Yaqiang Ji, et al.. (2017). Copper Hydroxide Porous Nanotube Arrays Grown on Copper Foils as High‐Performance Integrated Electrodes for Supercapacitors. ChemistrySelect. 2(29). 9570–9576. 14 indexed citations
17.
Chen, Nan, et al.. (2012). Effect of Sr2+ doping on the luminescence properties of YVO4:Eu3+,Sr2+ particles prepared by a solvothermal method. Journal of Sol-Gel Science and Technology. 65(3). 353–358. 17 indexed citations
18.
Liu, Qiang, Qifeng Han, & Guoping Du. (2011). Investigation into the thermal annealing effects on CuIn(S,Se)2 thin films prepared by solution processes. Journal of Materials Science Materials in Electronics. 23(2). 567–571. 2 indexed citations
19.
20.
Du, Guoping, et al.. (2008). Wire-sawing defects on multicrystalline silicon wafers grown by a directional solidification method. Semiconductor Science and Technology. 23(5). 55011–55011. 8 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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