Frank Windrich

443 total citations
15 papers, 346 citations indexed

About

Frank Windrich is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Polymers and Plastics. According to data from OpenAlex, Frank Windrich has authored 15 papers receiving a total of 346 indexed citations (citations by other indexed papers that have themselves been cited), including 10 papers in Electrical and Electronic Engineering, 7 papers in Biomedical Engineering and 5 papers in Polymers and Plastics. Recurrent topics in Frank Windrich's work include 3D IC and TSV technologies (9 papers), Synthesis and properties of polymers (5 papers) and Electronic Packaging and Soldering Technologies (4 papers). Frank Windrich is often cited by papers focused on 3D IC and TSV technologies (9 papers), Synthesis and properties of polymers (5 papers) and Electronic Packaging and Soldering Technologies (4 papers). Frank Windrich collaborates with scholars based in Germany, Netherlands and Switzerland. Frank Windrich's co-authors include Brigitte Voit, Mikhail Malanin, Klaus‐Jochen Eichhorn, Matthias Labrenz, Dieter Fischer, Martin G. J. Löder, Nieck E. Benes, Emiel J. Kappert, K.‐J. Eichhorn and Lars Bittrich and has published in prestigious journals such as Analytical and Bioanalytical Chemistry, European Polymer Journal and Polymer Testing.

In The Last Decade

Frank Windrich

15 papers receiving 334 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Frank Windrich Germany	6	234	205	91	49	46	15	346
H. J. Karam Kuwait	9	112 0.5×	96 0.5×	88 1.0×	26 0.5×	45 1.0×	21	350
Oriol Rius-Ayra Spain	12	139 0.6×	96 0.5×	117 1.3×	40 0.8×	59 1.3×	21	313
Elizabeth A. Lofgren United States	9	77 0.3×	51 0.2×	38 0.4×	13 0.3×	41 0.9×	17	331
Abhinav Malhotra United States	11	42 0.2×	52 0.3×	78 0.9×	35 0.7×	169 3.7×	18	320
Casey Smith United States	5	34 0.1×	22 0.1×	88 1.0×	48 1.0×	82 1.8×	11	245
Patrick Delprat France	8	71 0.3×	20 0.1×	24 0.3×	14 0.3×	51 1.1×	9	274
Jennifer Gaughran Ireland	11	38 0.2×	19 0.1×	243 2.7×	96 2.0×	23 0.5×	22	362
E. A. Lofgren United States	10	43 0.2×	45 0.2×	31 0.3×	19 0.4×	46 1.0×	15	329
Andrew H. Lebovitz United States	9	38 0.2×	35 0.2×	50 0.5×	14 0.3×	86 1.9×	9	365

Countries citing papers authored by Frank Windrich

Since Specialization

Citations

This map shows the geographic impact of Frank Windrich's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Frank Windrich with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Frank Windrich more than expected).

Fields of papers citing papers by Frank Windrich

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Frank Windrich. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Frank Windrich. The network helps show where Frank Windrich may publish in the future.

Co-authorship network of co-authors of Frank Windrich

This figure shows the co-authorship network connecting the top 25 collaborators of Frank Windrich. A scholar is included among the top collaborators of Frank Windrich based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Frank Windrich. Frank Windrich is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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15 of 15 papers shown

Windrich, Frank, et al.. (2023). Maskless direct write lithography for 3D wafer-level-system-integration. IMAPSource Proceedings. 2022(IMAPS Symposium). 2 indexed citations

Windrich, Frank, et al.. (2018). In-situ characterization of thin polyimide films used for microelectronic packaging. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1692. 1–6. 1 indexed citations

Windrich, Frank, et al.. (2018). Microfluidic Interposer for High Performance Fluidic Chip Cooling. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–8. 7 indexed citations

Bittrich, Eva, et al.. (2017). Determination of the glass transition temperature in thin polymeric films used for microelectronic packaging by temperature-dependent spectroscopic ellipsometry. Polymer Testing. 64. 48–54. 13 indexed citations

Windrich, Frank, Emiel J. Kappert, Mikhail Malanin, et al.. (2016). In-situ imidization analysis in microscale thin films of an ester-type photosensitive polyimide for microelectronic packaging applications. European Polymer Journal. 84. 279–291. 32 indexed citations

Windrich, Frank, Mikhail Malanin, K.‐J. Eichhorn, & Brigitte Voit. (2016). Rapid Scan In-Situ FT-IR Curing Studies of Low-Temperature Cure Thin Film Polymer Dielectrics in Solid State. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 227. 1698–1706. 4 indexed citations

Windrich, Frank, Martin G. J. Löder, Mikhail Malanin, et al.. (2015). Identification of microplastics by FTIR and Raman microscopy: a novel silicon filter substrate opens the important spectral range below 1300 cm−1 for FTIR transmission measurements. Analytical and Bioanalytical Chemistry. 407(22). 6791–6801. 251 indexed citations

Windrich, Frank, et al.. (2015). High Density Interposer – Challenges and Opportunities. IMAPSource Proceedings. 2015(1). 46–49. 3 indexed citations

Windrich, Frank, et al.. (2014). Low-Temperature Photosensitive Polyimide Processing for Use in 3D Integration Technologies. MRS Proceedings. 1692. 8 indexed citations

10.

Windrich, Frank, et al.. (2013). Front to backside alignment for TSV based 3D integration. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1–6. 1 indexed citations

11.

Windrich, Frank, et al.. (2013). 3D integration of standard integrated circuits. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1–7. 5 indexed citations

12.

Windrich, Frank, et al.. (2012). Via last technology for direct stacking of processor and flash. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1327–1332. 12 indexed citations

13.

Windrich, Frank, et al.. (2011). Cost-effective lithography for TSV-structures. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1407–1411. 3 indexed citations

14.

Windrich, Frank. (2006). Carbon Contacts and Resistors in Printed Circuit Boards - a Practical Overview. 788–793. 2 indexed citations

15.

Windrich, Frank, et al.. (2005). GC-IR based two-dimensional structural group analysis of petroleum products. Analytical and Bioanalytical Chemistry. 382(1). 186–191. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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