Eugene M. Chow

1.6k total citations · 1 hit paper
49 papers, 1.3k citations indexed

About

Eugene M. Chow is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Mechanical Engineering. According to data from OpenAlex, Eugene M. Chow has authored 49 papers receiving a total of 1.3k indexed citations (citations by other indexed papers that have themselves been cited), including 38 papers in Electrical and Electronic Engineering, 23 papers in Biomedical Engineering and 14 papers in Mechanical Engineering. Recurrent topics in Eugene M. Chow's work include Advanced MEMS and NEMS Technologies (13 papers), Modular Robots and Swarm Intelligence (11 papers) and 3D IC and TSV technologies (11 papers). Eugene M. Chow is often cited by papers focused on Advanced MEMS and NEMS Technologies (13 papers), Modular Robots and Swarm Intelligence (11 papers) and 3D IC and TSV technologies (11 papers). Eugene M. Chow collaborates with scholars based in United States and Belgium. Eugene M. Chow's co-authors include Thomas W. Kenny, Kevin Yasumura, D. Rugar, Barry Stipe, T. D. Stowe, T. Pfafman, Aaron Partridge, C. F. Quate, Tom Kenny and N.I. Maluf and has published in prestigious journals such as Applied Physics Letters, American Journal of Physiology-Cell Physiology and Sensors and Actuators A Physical.

In The Last Decade

Eugene M. Chow

48 papers receiving 1.2k citations

Hit Papers

align trajectories

What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

Quality factors in micron- and submicron-thick cantilevers

2000 529 citations Kevin Yasumura, T. D. Stowe et al. Journal of Microelectromechanical Systems profile →

Peers

Eugene M. Chow

EEE

AMPO

BE

MM

MC

Neal A. Hall United States

John Hedley United Kingdom

G. Reyne France

Zhengyong Liu China

Dominique Collard France

M. Parameswaran Canada

Kazuyuki MINAMI Japan

Van Thanh Dau Australia

Eun Sok Kim United States

M. Elwenspoek Netherlands

Neal A. Hall United States

Eugene M. Chow

940 ×1.0

EEE

518 ×0.8

AMPO

654 ×1.5

BE

98 ×0.7

MM

127 ×1.0

MC

Citations per year, relative to Eugene M. Chow Eugene M. Chow (= 1×) peers Neal A. Hall

Countries citing papers authored by Eugene M. Chow

Since Specialization

Citations

This map shows the geographic impact of Eugene M. Chow's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Eugene M. Chow with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Eugene M. Chow more than expected).

Fields of papers citing papers by Eugene M. Chow

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Eugene M. Chow. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Eugene M. Chow. The network helps show where Eugene M. Chow may publish in the future.

Co-authorship network of co-authors of Eugene M. Chow

This figure shows the co-authorship network connecting the top 25 collaborators of Eugene M. Chow. A scholar is included among the top collaborators of Eugene M. Chow based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Eugene M. Chow. Eugene M. Chow is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

1.

Raychaudhuri, Sourobh, et al.. (2024). 91‐5: Late‐News Paper: The MicroAssembler: Deterministic Fluidic Assembly for Manufacturing MicroLED Displays. SID Symposium Digest of Technical Papers. 55(1). 1289–1292.

2.

Zhong, Zhanwei, et al.. (2019). Test-Cost Reduction for 2.5D ICs Using Microspring Technology for Die Attachment and Rework. 17. 1–6. 1 indexed citations

3.

Chow, Eugene M., Julie A. Bert, Lara S. Crawford, et al.. (2017). Micro-object assembly with an optically addressed array. Rare & Special e-Zone (The Hong Kong University of Science and Technology). 682–685. 11 indexed citations

4.

Pirmoradi, Fatemeh Nazly, Ashish Pattekar, Michael I. Recht, et al.. (2015). A microarray MEMS device for biolistic delivery of vaccine and drug powders. Human Vaccines & Immunotherapeutics. 11(8). 1936–1944. 7 indexed citations

5.

Ready, Steven, et al.. (2013). 3D Printed Electronics. Technical programs and proceedings. 29(1). 9–12. 6 indexed citations

6.

Cheng, Bowen, Eugene M. Chow, Dirk De Bruyker, et al.. (2011). Current crowding study of a micro spring contact for flip chip packaging. 5343. 360–363. 1 indexed citations

7.

Shubin, Ivan, Alex Chow, J. E. Cunningham, et al.. (2010). A package demonstration with solder free compliant flexible interconnects. 1429–1435. 9 indexed citations

8.

Chow, Eugene M., D. K. Fork, C.L. Chua, Koenraad Van Schuylenbergh, & Thomas Hantschel. (2009). Wafer-Level Packaging With Soldered Stress-Engineered Micro-Springs. IEEE Transactions on Advanced Packaging. 32(2). 372–378. 16 indexed citations

9.

Shubin, Ivan, Eugene M. Chow, J. E. Cunningham, et al.. (2009). Novel packaging with rematable spring interconnect chips for MCM. 31 indexed citations

10.

Guo, X. Edward, Erica Takai, Xingyu Jiang, et al.. (2006). Intracellular calcium waves in bone cell networks under single cell nanoindentation.. PubMed. 3(3). 95–107. 37 indexed citations

11.

Chow, Eugene M., et al.. (2005). High voltage thin film transistors integrated with MEMS. Sensors and Actuators A Physical. 130-131. 297–301. 31 indexed citations

12.

Chow, Eugene M., et al.. (2005). High voltage thin film transistors integrated with MEMS. 2. 1318–1321. 1 indexed citations

13.

Chow, Eugene M., Thomas Hantschel, K. Klein, et al.. (2004). Micro-spring force characterization and applications in integrated circuit packaging and scanning probe MEMS metrology. 1. 408–411. 6 indexed citations

14.

Cheng, Ching‐Hsiang, et al.. (2002). An efficient electrical addressing method using through-wafer vias for two-dimensional ultrasonic arrays. 2. 1179–1182. 54 indexed citations

15.

Chow, Eugene M., V. Chandrasekaran, Aaron Partridge, et al.. (2002). Process compatible polysilicon-based electrical through-wafer interconnects in silicon substrates. Journal of Microelectromechanical Systems. 11(6). 631–640. 72 indexed citations

16.

Chandrasekaran, V., Eugene M. Chow, Thomas Kenny, et al.. (2002). Thermoelastically Actuated Acoustic Proximity Sensor with Integrated Through-Wafer Interconnects. 102–107. 4 indexed citations

17.

Hantschel, Thomas, Eugene M. Chow, D. Rudolph, & D. K. Fork. (2002). Stressed metal probes for atomic force microscopy. Applied Physics Letters. 81(16). 3070–3072. 8 indexed citations

18.

Chow, Eugene M., Aaron Partridge, C. F. Quate, & Thomas W. Kenny. (2000). Through-Wafer Electrical Interconnects Compatible with Standard Semiconductor Processing. 343–346. 8 indexed citations

19.

Partridge, Aaron, J. K. Reynolds, Benjamin W. Chui, et al.. (2000). A high-performance planar piezoresistive accelerometer. Journal of Microelectromechanical Systems. 9(1). 58–66. 151 indexed citations

20.

Yasumura, Kevin, T. D. Stowe, Eugene M. Chow, et al.. (2000). Quality factors in micron- and submicron-thick cantilevers. Journal of Microelectromechanical Systems. 9(1). 117–125. 529 indexed citations breakdown →

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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