De‐Shin Liu

580 total citations
56 papers, 436 citations indexed

About

De‐Shin Liu is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Biomedical Engineering. According to data from OpenAlex, De‐Shin Liu has authored 56 papers receiving a total of 436 indexed citations (citations by other indexed papers that have themselves been cited), including 25 papers in Mechanical Engineering, 24 papers in Electrical and Electronic Engineering and 12 papers in Biomedical Engineering. Recurrent topics in De‐Shin Liu's work include Electronic Packaging and Soldering Technologies (20 papers), 3D IC and TSV technologies (15 papers) and Advanced Surface Polishing Techniques (9 papers). De‐Shin Liu is often cited by papers focused on Electronic Packaging and Soldering Technologies (20 papers), 3D IC and TSV technologies (15 papers) and Advanced Surface Polishing Techniques (9 papers). De‐Shin Liu collaborates with scholars based in Taiwan, United States and India. De‐Shin Liu's co-authors include R.C. Batra, Shu‐Lin Hsu, Chia‐Yuan Chang, Martin Balog, František Šimančík, María Victoria Castro Riglos, Peter Krížik, Martin Nosko, Meng-Kai Shih and Hong‐Tzong Yau and has published in prestigious journals such as Materials Science and Engineering A, Journal of Applied Mechanics and Journal of Physics D Applied Physics.

In The Last Decade

De‐Shin Liu

48 papers receiving 418 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
De‐Shin Liu Taiwan 12 180 117 107 61 49 56 436
Maryam Mahnama Iran 13 291 1.6× 35 0.3× 101 0.9× 60 1.0× 113 2.3× 30 408
Abbas Rahi Iran 14 356 2.0× 84 0.7× 93 0.9× 99 1.6× 154 3.1× 36 503
Kazuki Watanabe Japan 14 163 0.9× 62 0.5× 111 1.0× 55 0.9× 103 2.1× 55 411
Jinling Gao United States 13 129 0.7× 345 2.9× 160 1.5× 123 2.0× 61 1.2× 41 669
Michael Okereke United Kingdom 14 188 1.0× 122 1.0× 79 0.7× 181 3.0× 115 2.3× 42 633
Jiapeng Liao China 7 278 1.5× 47 0.4× 147 1.4× 170 2.8× 25 0.5× 20 419
Rong Fu China 12 181 1.0× 25 0.2× 69 0.6× 140 2.3× 82 1.7× 29 430
Md Syam Hasan United States 10 361 2.0× 42 0.4× 107 1.0× 228 3.7× 35 0.7× 12 502
Vijaya Kumar India 8 373 2.1× 58 0.5× 56 0.5× 137 2.2× 103 2.1× 10 476
Junyan Guo Singapore 12 101 0.6× 48 0.4× 113 1.1× 49 0.8× 123 2.5× 30 561

Countries citing papers authored by De‐Shin Liu

Since Specialization
Citations

This map shows the geographic impact of De‐Shin Liu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by De‐Shin Liu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites De‐Shin Liu more than expected).

Fields of papers citing papers by De‐Shin Liu

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by De‐Shin Liu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by De‐Shin Liu. The network helps show where De‐Shin Liu may publish in the future.

Co-authorship network of co-authors of De‐Shin Liu

This figure shows the co-authorship network connecting the top 25 collaborators of De‐Shin Liu. A scholar is included among the top collaborators of De‐Shin Liu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with De‐Shin Liu. De‐Shin Liu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
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Alfantazi, Akram, et al.. (2025). Uniaxial tensile and compressive deformation performance of closed-cell aluminum hybrid foams. Materials Chemistry and Physics. 342. 130940–130940. 2 indexed citations
3.
Mandal, Ajay, et al.. (2024). Carbon nanotubes used to enhance the wear properties of AlSi10Mg/CNTs nanocomposites prepared through additive manufacturing. Diamond and Related Materials. 144. 110993–110993. 3 indexed citations
4.
Alfantazi, Akram, et al.. (2024). Microstructural and mechanical properties study of various lattice structures of SS316L-CNTs nano composites fabricated through additive manufacturing. Journal of Physics D Applied Physics. 58(6). 65501–65501. 1 indexed citations
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Liu, De‐Shin, et al.. (2017). A Finite Element Investigation into the Impact Performance of an Open-Face Motorcycle Helmet with Ventilation Slots. Applied Sciences. 7(3). 279–279. 6 indexed citations
8.
Haniffa, Mhd. Abd. Cader Mhd., et al.. (2017). Synthesis, Characterization and the Solvent Effects on Interfacial Phenomena of Jatropha Curcas Oil Based Non-Isocyanate Polyurethane. Polymers. 9(5). 162–162. 26 indexed citations
9.
Liu, De‐Shin, et al.. (2013). Coupled PIEM/FEM Algorithm Based onMindlin-Reissner Plate Theory for Bending Analysis ofPlates with Through-Thickness Hole. Computer Modeling in Engineering & Sciences. 92(6). 573–594.
10.
Liu, De‐Shin, et al.. (2012). Eigenvalue Analysis of MEMS Components with Multi-defect using Infinite Element Method Algorithm. Cmc-computers Materials & Continua. 28(2). 97–120. 1 indexed citations
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Liu, De‐Shin, et al.. (2012). A Hybrid FEM-Neural Network Approach for Predicting Ethylene Vinyl Acetate Expansion Shape on Injection Molding Process. Advanced Science Letters. 16(1). 1–6. 1 indexed citations
13.
Liu, De‐Shin, et al.. (2011). Modeling of moisture diffusion in permeable fiber-reinforced polymer composites using heterogeneous hybrid moisture element method. Cmc-computers Materials & Continua. 19(2). 111–136. 1 indexed citations
14.
Liu, De‐Shin, et al.. (2010). Thin wafer probe breaking strength testing using microforce tester. 32. 1–4.
15.
Liu, De‐Shin, et al.. (2009). Modeling of Moisture Diffusion in Heterogeneous Epoxy Resin Containing Multiple Randomly Distributed Particles Using Hybrid Moisture Element Method. Cmc-computers Materials & Continua. 13(2). 89–114. 1 indexed citations
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Liu, De‐Shin, et al.. (2008). Bondability Study of Chip-on-Film (COF) Inner Lead Bonding (ILB) Using Conventional Gang Bonder. IEEE Transactions on Electronics Packaging Manufacturing. 31(4). 285–290. 6 indexed citations
19.
Lyu, Shaw‐Ruey, et al.. (2006). Mechanical strength of mediopatellar plica – The influence of its fiber content. Clinical Biomechanics. 21(8). 860–863. 18 indexed citations
20.
Liu, De‐Shin, et al.. (2006). Design of a novel chip on glass package solution for CMOS image sensor device. Microelectronics Reliability. 46(8). 1326–1334. 8 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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