Choong Don Yoo

664 total citations
24 papers, 552 citations indexed

About

Choong Don Yoo is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Mechanics of Materials. According to data from OpenAlex, Choong Don Yoo has authored 24 papers receiving a total of 552 indexed citations (citations by other indexed papers that have themselves been cited), including 12 papers in Mechanical Engineering, 12 papers in Electrical and Electronic Engineering and 8 papers in Mechanics of Materials. Recurrent topics in Choong Don Yoo's work include Welding Techniques and Residual Stresses (9 papers), 3D IC and TSV technologies (7 papers) and Electronic Packaging and Soldering Technologies (5 papers). Choong Don Yoo is often cited by papers focused on Welding Techniques and Residual Stresses (9 papers), 3D IC and TSV technologies (7 papers) and Electronic Packaging and Soldering Technologies (5 papers). Choong Don Yoo collaborates with scholars based in South Korea and United States. Choong Don Yoo's co-authors include Dave F. Farson, Sung H. Ko, Jae Young Lee, Ji-Hye Lee, Jihye Lee, Jae‐Hak Lee, Jung Ho Kim, R. W. Richardson, In So Kweon and Sang Kyu Choi and has published in prestigious journals such as Journal of Physics D Applied Physics, Pattern Recognition Letters and Sensors and Actuators A Physical.

In The Last Decade

Choong Don Yoo

22 papers receiving 529 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Choong Don Yoo South Korea 11 446 141 117 114 63 24 552
Flemming Ove Olsen Denmark 13 578 1.3× 351 2.5× 120 1.0× 101 0.9× 91 1.4× 42 746
Jinqiang Gao China 18 823 1.8× 68 0.5× 67 0.6× 203 1.8× 39 0.6× 48 870
S.-J. Na South Korea 11 402 0.9× 105 0.7× 30 0.3× 109 1.0× 33 0.5× 30 451
V. Madhavan United States 14 457 1.0× 68 0.5× 144 1.2× 148 1.3× 320 5.1× 41 600
Guoxiang Xu China 18 814 1.8× 111 0.8× 52 0.4× 116 1.0× 65 1.0× 50 906
Jens Standfuß Germany 13 453 1.0× 92 0.7× 47 0.4× 61 0.5× 30 0.5× 29 516
S.J. Na South Korea 12 412 0.9× 174 1.2× 28 0.2× 63 0.6× 29 0.5× 15 501
G. den Ouden Netherlands 14 610 1.4× 73 0.5× 62 0.5× 137 1.2× 28 0.4× 34 674
Berndt Brenner Germany 14 515 1.2× 153 1.1× 53 0.5× 97 0.9× 34 0.5× 61 598
Koichi Masubuchi United States 14 640 1.4× 166 1.2× 50 0.4× 160 1.4× 16 0.3× 73 730

Countries citing papers authored by Choong Don Yoo

Since Specialization
Citations

This map shows the geographic impact of Choong Don Yoo's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Choong Don Yoo with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Choong Don Yoo more than expected).

Fields of papers citing papers by Choong Don Yoo

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Choong Don Yoo. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Choong Don Yoo. The network helps show where Choong Don Yoo may publish in the future.

Co-authorship network of co-authors of Choong Don Yoo

This figure shows the co-authorship network connecting the top 25 collaborators of Choong Don Yoo. A scholar is included among the top collaborators of Choong Don Yoo based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Choong Don Yoo. Choong Don Yoo is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Park, Seung‐Bae, et al.. (2014). Development of Inclined Conductive Bump for Flip-Chip Interconnection. IEEE Transactions on Components Packaging and Manufacturing Technology. 5(2). 207–216. 1 indexed citations
2.
Kim, Kwang‐Seok, et al.. (2010). Effect of Process Parameters on TSV Formation Using Deep Reactive Ion Etching. Korean Journal of Metals and Materials. 48(11). 1028–1034. 15 indexed citations
3.
Lee, Jae‐Hak, et al.. (2009). Force–displacement model for analysis of pulsed-GMAW. Journal of Physics D Applied Physics. 42(3). 35504–35504. 10 indexed citations
4.
Lee, Jae‐Hak, et al.. (2009). Pre-bonding method using self-alignment effect for multichip packaging. 142. 118–123.
5.
Lee, Jae‐Hak, et al.. (2008). Modelling of globular transfer considering momentum flux in GMAW. Journal of Physics D Applied Physics. 41(19). 195503–195503. 28 indexed citations
6.
Lee, Jihye & Choong Don Yoo. (2008). Thermosonic soldering of cross-aligned strip solder bumps for easy alignment and low-temperature bonding. Journal of Micromechanics and Microengineering. 18(12). 125002–125002. 8 indexed citations
7.
Lee, Jae‐Hak, et al.. (2008). Fabrication of LCD color filter using laser-induced thermal spray printing. Sensors and Actuators A Physical. 148(2). 454–461. 4 indexed citations
8.
Lee, Jae‐Hak, Choong Don Yoo, & Yong-Seok Kim. (2006). A laser-induced thermal spray printing process for phosphor layer deposition of PDP. Journal of Micromechanics and Microengineering. 17(2). 258–264. 6 indexed citations
9.
Lee, Ji-Hye, et al.. (2006). Influence of pad shape on self-alignment in electronic packaging. Journal of Electronic Materials. 35(3). 411–415. 6 indexed citations
10.
Lee, Jihye, Jung Ho Kim, & Choong Don Yoo. (2005). Thermosonic bonding of lead-free solder with metal bump for flip-chip bonding. Journal of Electronic Materials. 34(1). 96–102. 37 indexed citations
11.
Lee, Jae Young, Sung H. Ko, Dave F. Farson, & Choong Don Yoo. (2002). Mechanism of keyhole formation and stability in stationary laser welding. Journal of Physics D Applied Physics. 35(13). 1570–1576. 258 indexed citations
12.
Kweon, In So, et al.. (2002). COP: a new corner detector. Pattern Recognition Letters. 23(11). 1349–1360. 23 indexed citations
13.
Yoo, Choong Don. (2001). Effects of surface depression on pool convection and geometry in stationary GTAW. Welding Journal. 0–0. 18 indexed citations
14.
Yoo, Choong Don. (2001). Simulation of dynamic behavior in a GMAW system. Welding Journal. 80(10). 0–0. 35 indexed citations
15.
Lee, Ji-Hye, et al.. (2001). Dynamic force balance model for metal transfer analysis in arc welding. Journal of Physics D Applied Physics. 34(17). 2658–2664. 48 indexed citations
16.
Ko, Sung H., Choong Don Yoo, Dave F. Farson, & Sang Kyu Choi. (2000). Mathematical modeling of the dynamic behavior of gas tungsten arc weld pools. Metallurgical and Materials Transactions B. 31(6). 1465–1473. 19 indexed citations
17.
Choi, Sang Kyu, et al.. (1996). Analysis of Metal Transfer Through Equilibrium Shape of Pendent Drop in GMAW.. QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY. 14(2). 243–247. 2 indexed citations
18.
Yoo, Choong Don, et al.. (1996). Effects of Welding Conditions on Molten Drop Geometry in Arc Welding. Journal of Manufacturing Science and Engineering. 118(4). 623–627. 2 indexed citations
19.
Yoo, Choong Don & R. W. Richardson. (1993). An Experimental Study on Sensitvity and Signal Characteristics of Welds Pool Oscillation. Transactions of the Japan Welding Society. 24(2). 54–62. 11 indexed citations
20.
Yoo, Choong Don. (1990). Effects of weld pool conditions on pool oscillation /. OhioLink ETD Center (Ohio Library and Information Network). 7 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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