Cheng‐fu Chen

907 total citations
47 papers, 751 citations indexed

About

Cheng‐fu Chen is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Mechanics of Materials. According to data from OpenAlex, Cheng‐fu Chen has authored 47 papers receiving a total of 751 indexed citations (citations by other indexed papers that have themselves been cited), including 25 papers in Electrical and Electronic Engineering, 18 papers in Biomedical Engineering and 13 papers in Mechanics of Materials. Recurrent topics in Cheng‐fu Chen's work include Electronic Packaging and Soldering Technologies (11 papers), 3D IC and TSV technologies (9 papers) and Advancements in Photolithography Techniques (8 papers). Cheng‐fu Chen is often cited by papers focused on Electronic Packaging and Soldering Technologies (11 papers), 3D IC and TSV technologies (9 papers) and Advancements in Photolithography Techniques (8 papers). Cheng‐fu Chen collaborates with scholars based in United States, China and Taiwan. Cheng‐fu Chen's co-authors include Yanhong Gu, Chengyun Ning, Sukumar Bandopadhyay, Junqing Zhang, Lei Zhang, Yuanjun Guo, Yuanjun Guo, Yongjun Zhang, Dyi‐Cheng Chen and K. B. Wharton and has published in prestigious journals such as SHILAP Revista de lepidopterología, Langmuir and Journal of Chromatography A.

In The Last Decade

Cheng‐fu Chen

41 papers receiving 719 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Cheng‐fu Chen United States 12 482 455 308 202 135 47 751
Shun-Yi Jian Taiwan 17 396 0.8× 515 1.1× 316 1.0× 71 0.4× 125 0.9× 39 712
K.Y. Chiu Hong Kong 10 431 0.9× 523 1.1× 415 1.3× 177 0.9× 190 1.4× 10 832
Zhenzhen Gui China 12 224 0.5× 210 0.5× 231 0.8× 84 0.4× 56 0.4× 41 469
Xiaohong Chen China 18 138 0.3× 408 0.9× 339 1.1× 114 0.6× 124 0.9× 40 693
Xiaohong Chen China 9 198 0.4× 172 0.4× 136 0.4× 164 0.8× 95 0.7× 20 459
G. S. D’yakonov Russia 15 196 0.4× 738 1.6× 553 1.8× 124 0.6× 245 1.8× 72 974
Yunfei Ding China 12 796 1.7× 715 1.6× 611 2.0× 269 1.3× 102 0.8× 20 1.1k
Jianhong Qiu United States 10 327 0.7× 284 0.6× 156 0.5× 173 0.9× 52 0.4× 24 527
V.V. Lyubimov Russia 11 292 0.6× 475 1.0× 379 1.2× 168 0.8× 220 1.6× 29 789
Tatsuya Miyajima Japan 15 122 0.3× 206 0.5× 248 0.8× 197 1.0× 237 1.8× 49 624

Countries citing papers authored by Cheng‐fu Chen

Since Specialization
Citations

This map shows the geographic impact of Cheng‐fu Chen's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Cheng‐fu Chen with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Cheng‐fu Chen more than expected).

Fields of papers citing papers by Cheng‐fu Chen

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Cheng‐fu Chen. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Cheng‐fu Chen. The network helps show where Cheng‐fu Chen may publish in the future.

Co-authorship network of co-authors of Cheng‐fu Chen

This figure shows the co-authorship network connecting the top 25 collaborators of Cheng‐fu Chen. A scholar is included among the top collaborators of Cheng‐fu Chen based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Cheng‐fu Chen. Cheng‐fu Chen is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
2.
Chen, Cheng‐fu, et al.. (2024). CO2 transport in supercritical state: Nikiski, Alaska pipeline study. Greenhouse Gases Science and Technology. 14(6). 942–953.
3.
Chen, Cheng‐fu. (2023). Polystyrene Coating on APTES-Primed Hydroxylated AA2024-T3: Characterization and Failure Mechanism of Corrosion. SHILAP Revista de lepidopterología. 4(3). 254–267. 3 indexed citations
4.
Chen, Cheng‐fu, et al.. (2023). The Role of APTES as a Primer for Polystyrene Coated AA2024-T3. Micromachines. 15(1). 93–93. 2 indexed citations
5.
Chen, Cheng‐fu, et al.. (2014). Interplay and influence of thermomechanical stress in copper-filled TSV interposers. 963–966. 5 indexed citations
6.
Gu, Yanhong, Sukumar Bandopadhyay, Cheng‐fu Chen, Yuanjun Guo, & Chengyun Ning. (2012). Effect of oxidation time on the corrosion behavior of micro-arc oxidation produced AZ31 magnesium alloys in simulated body fluid. Journal of Alloys and Compounds. 543. 109–117. 113 indexed citations
7.
Chen, Cheng‐fu, et al.. (2012). A New Modeling Strategy for the Transient Behavior of Tire-Snow Interaction. SAE technical papers on CD-ROM/SAE technical paper series. 1. 1 indexed citations
8.
Chen, Cheng‐fu, et al.. (2012). A study of non-operational dynamic responses of disk in 3.5 in. hard disk drive to impact load. Microsystem Technologies. 18(9-10). 1261–1266.
9.
Chen, Cheng‐fu, et al.. (2011). Stress Buildup of Sn3.5Ag Soldered Stacked CSPs to Board-Level Drop Impact. IEEE Transactions on Components Packaging and Manufacturing Technology. 1(3). 344–351. 2 indexed citations
10.
11.
Chen, Cheng‐fu, et al.. (2009). Dependence of Flip Chip Solder Reliability on Filler Settling. IEEE Transactions on Advanced Packaging. 32(4). 711–719. 3 indexed citations
12.
Chen, Cheng‐fu & Kelly L. Drew. (2008). Droplet-based microdialysis—Concept, theory, and design considerations. Journal of Chromatography A. 1209(1-2). 29–36. 11 indexed citations
13.
Chen, Cheng‐fu, et al.. (2008). Underfill FillerSettling Effect on the Die Backside Interfacial Stresses of Flip ChipPackages. Journal of Electronic Packaging. 130(3). 7 indexed citations
14.
Chen, Cheng‐fu. (2008). Effect of underfill filler settling on thermo-mechanical fatigue analysis of flip-chip eutectic solders. Microelectronics Reliability. 48(7). 1040–1051. 5 indexed citations
15.
Chen, Cheng‐fu. (2004). Energy efficient routing for clustered wireless sensors network. 2. 1437–1440. 4 indexed citations
16.
Reu, Phillip L., Cheng‐fu Chen, Roxann L. Engelstad, et al.. (2002). Predicting overlay performance for electron projection lithography masks. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 4688. 547–547. 2 indexed citations
17.
White, D. L., Obert R. Wood, Cheng‐fu Chen, Edward G. Lovell, & Roxann L. Engelstad. (2002). Complete system of nanoimprint lithography for IC production. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 4688. 214–214. 5 indexed citations
18.
Chen, Cheng‐fu, et al.. (2001). <title>Vibrational analysis of 200-mm EPL masks</title>. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 4343. 383–391.
19.
Chen, Cheng‐fu, et al.. (2000). Simulating the mechanical response of electron-beam projection lithography masks. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 18(6). 3248–3253. 3 indexed citations
20.
Chen, Cheng‐fu & A. Seireg. (2000). A linear programming approach for proximity analysis and collision avoidance of polyhedral objects.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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