Chase Cook

537 total citations
20 papers, 396 citations indexed

About

Chase Cook is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Hardware and Architecture. According to data from OpenAlex, Chase Cook has authored 20 papers receiving a total of 396 indexed citations (citations by other indexed papers that have themselves been cited), including 14 papers in Electrical and Electronic Engineering, 9 papers in Electronic, Optical and Magnetic Materials and 4 papers in Hardware and Architecture. Recurrent topics in Chase Cook's work include Semiconductor materials and devices (11 papers), Copper Interconnects and Reliability (9 papers) and Electronic Packaging and Soldering Technologies (6 papers). Chase Cook is often cited by papers focused on Semiconductor materials and devices (11 papers), Copper Interconnects and Reliability (9 papers) and Electronic Packaging and Soldering Technologies (6 papers). Chase Cook collaborates with scholars based in United States, China and Germany. Chase Cook's co-authors include Hans Rudi Fischer, Sheldon X.-D. Tan, Zeyu Sun, Mehul D. Shroff, Taeyoung Kim, Hussam Amrouch, Hengyang Zhao, Jörg Henkel, Masayuki Hiromoto and Takashi Satō and has published in prestigious journals such as IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on Very Large Scale Integration (VLSI) Systems and Mathematische Annalen.

In The Last Decade

Chase Cook

20 papers receiving 347 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Chase Cook United States	10	178	136	87	84	80	20	396
Ladislav Beran Czechia	8	69 0.4×	49 0.4×	60 0.7×	26 0.3×	35 0.4×	23	411
Zhengwei Liu United States	12	82 0.5×	8 0.1×	3 0.0×	77 0.9×	98 1.2×	46	301
Calvin T. Long United States	9	19 0.1×	4 0.0×	7 0.1×	89 1.1×	76 0.9×	39	326
Roland Bacher France	9	21 0.1×	4 0.0×	4 0.0×	127 1.5×	71 0.9×	36	246
James A. Sellers United States	18	97 0.5×	27 0.2×	1 0.0×	72 0.9×	51 0.6×	115	970
Xavier Hubaut Belgium	7	220 1.2×	6 0.0×	3 0.0×	93 1.1×	24 0.3×	11	373
M. I. Kargapolov Ukraine	5	63 0.4×	2 0.0×	8 0.1×	195 2.3×	103 1.3×	7	411
Carl C. Cowen United States	18	54 0.3×	5 0.0×	2 0.0×	298 3.5×	274 3.4×	47	1.2k
Mary Flahive United States	7	32 0.2×	10 0.1×	1 0.0×	84 1.0×	83 1.0×	13	240

Countries citing papers authored by Chase Cook

Since Specialization

Citations

This map shows the geographic impact of Chase Cook's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chase Cook with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chase Cook more than expected).

Fields of papers citing papers by Chase Cook

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Chase Cook. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chase Cook. The network helps show where Chase Cook may publish in the future.

Co-authorship network of co-authors of Chase Cook

This figure shows the co-authorship network connecting the top 25 collaborators of Chase Cook. A scholar is included among the top collaborators of Chase Cook based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Chase Cook. Chase Cook is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Tan, Sheldon X.-D., et al.. (2020). Fast Physics-Based Electromigration Analysis for Full-Chip Networks by Efficient Eigenfunction-Based Solution. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 40(3). 507–520. 9 indexed citations

Cook, Chase, et al.. (2019). Reliability based hardware Trojan design using physics-based electromigration models. Integration. 66. 9–15. 7 indexed citations

Cook, Chase, Hengyang Zhao, Takashi Satō, Masayuki Hiromoto, & Sheldon X.-D. Tan. (2019). GPU-based Ising computing for solving max-cut combinatorial optimization problems. Integration. 69. 335–344. 26 indexed citations

Cook, Chase, et al.. (2018). Reliability Based Hardware Trojan Design Using Physics-Based Electromigration Models. 5–8. 1 indexed citations

Kim, Taeyoung, Sheldon X.-D. Tan, Chase Cook, & Zeyu Sun. (2018). Detection of counterfeited ICs via on-chip sensor and post-fabrication authentication policy. Integration. 63. 31–40. 3 indexed citations

Cook, Chase, et al.. (2018). Accelerating Electromigration Wear-Out Effects Based on Configurable Sink-Structured Wires. 21–24. 3 indexed citations

Sun, Zeyu, et al.. (2018). Fast Electromigration Immortality Analysis for Multisegment Copper Interconnect Wires. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 37(12). 3137–3150. 30 indexed citations

Cook, Chase, et al.. (2018). Fast Electromigration Stress Evolution Analysis for Interconnect Trees Using Krylov Subspace Method. IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 26(5). 969–980. 41 indexed citations

Wang, Xiaoyi, Yan Yan, Jian He, et al.. (2017). Fast physics-based electromigration analysis for multi-branch interconnect trees. International Conference on Computer Aided Design. 169–176. 12 indexed citations

10.

Tan, Sheldon X.-D., Hussam Amrouch, Taeyoung Kim, et al.. (2017). Recent advances in EM and BTI induced reliability modeling, analysis and optimization (invited). Integration. 60. 132–152. 34 indexed citations

11.

Wang, Xiaoyi, et al.. (2017). Fast physics-based electromigration analysis for multi-branch interconnect trees. 169–176. 10 indexed citations

12.

Kim, Taeyoung, Zeyu Sun, Chase Cook, et al.. (2016). Invited - Cross-layer modeling and optimization for electromigration induced reliability. 1–6. 4 indexed citations

13.

Kim, Taeyoung, Zeyu Sun, Chase Cook, et al.. (2016). Dynamic reliability management for near-threshold dark silicon processors. 1–7. 6 indexed citations

14.

Cook, Chase, Zeyu Sun, Taeyoung Kim, & Sheldon X.-D. Tan. (2016). Finite difference method for electromigration analysis of multi-branch interconnects. 13 indexed citations

15.

Cook, Chase. (1977). A numerical investigation of the finite element method in compressible primitive variable Navier-Stokes flow. NASA STI Repository (National Aeronautics and Space Administration). 77. 24424. 2 indexed citations

16.

Cook, Chase. (1973). Compact pseudo-convergences. Mathematische Annalen. 202(3). 193–202. 5 indexed citations

17.

Cook, Chase. (1968). On continuous extensions. Mathematische Annalen. 176(4). 302–304. 5 indexed citations

18.

Cook, Chase & Hans Rudi Fischer. (1967). Uniform convergence structures. Mathematische Annalen. 173(4). 290–306. 71 indexed citations

19.

Cook, Chase & Hans Rudi Fischer. (1967). Regular convergence spaces. Mathematische Annalen. 174(1). 1–7. 54 indexed citations

20.

Cook, Chase & Hans Rudi Fischer. (1965). On equicontinuity and continuous convergence. Mathematische Annalen. 159(2). 94–104. 60 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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