Boping Wu

474 total citations
35 papers, 369 citations indexed

About

Boping Wu is a scholar working on Electrical and Electronic Engineering, Aerospace Engineering and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, Boping Wu has authored 35 papers receiving a total of 369 indexed citations (citations by other indexed papers that have themselves been cited), including 31 papers in Electrical and Electronic Engineering, 14 papers in Aerospace Engineering and 7 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in Boping Wu's work include Electromagnetic Compatibility and Noise Suppression (20 papers), Advanced Antenna and Metasurface Technologies (13 papers) and 3D IC and TSV technologies (13 papers). Boping Wu is often cited by papers focused on Electromagnetic Compatibility and Noise Suppression (20 papers), Advanced Antenna and Metasurface Technologies (13 papers) and 3D IC and TSV technologies (13 papers). Boping Wu collaborates with scholars based in United States, China and Germany. Boping Wu's co-authors include Leung Tsang, Xiaoxiong Gu, Leung Tsang, Mark B. Ritter, Chong‐Jin Ong, Christian Baks, Gareth Hougham, R. John, Dong Gun Kam and Young Kwark and has published in prestigious journals such as IEEE Transactions on Microwave Theory and Techniques, Journal of the Optical Society of America A and IEEE Antennas and Wireless Propagation Letters.

In The Last Decade

Boping Wu

33 papers receiving 352 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Boping Wu United States 10 332 103 80 23 16 35 369
Pablo Soto Spain 14 450 1.4× 237 2.3× 111 1.4× 31 1.3× 9 0.6× 60 496
Sidina Wane France 10 308 0.9× 82 0.8× 50 0.6× 27 1.2× 9 0.6× 84 345
Supriyo Dey United States 7 272 0.8× 207 2.0× 83 1.0× 30 1.3× 8 0.5× 13 316
Xiangqiang Li China 9 238 0.7× 202 2.0× 101 1.3× 12 0.5× 9 0.6× 41 303
Futoshi Kuroki Japan 9 356 1.1× 184 1.8× 48 0.6× 38 1.7× 17 1.1× 126 378
S. Sarkar United States 14 667 2.0× 145 1.4× 22 0.3× 44 1.9× 13 0.8× 44 692
N. Hojjat Iran 10 351 1.1× 283 2.7× 88 1.1× 58 2.5× 10 0.6× 29 423
K.K. Chan Canada 10 258 0.8× 283 2.7× 58 0.7× 12 0.5× 48 3.0× 65 368
Päivi Koivisto Finland 11 208 0.6× 188 1.8× 89 1.1× 29 1.3× 24 1.5× 39 322
Fernando Daniel Quesada Pereira Spain 11 449 1.4× 290 2.8× 121 1.5× 32 1.4× 12 0.8× 83 502

Countries citing papers authored by Boping Wu

Since Specialization
Citations

This map shows the geographic impact of Boping Wu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Boping Wu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Boping Wu more than expected).

Fields of papers citing papers by Boping Wu

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Boping Wu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Boping Wu. The network helps show where Boping Wu may publish in the future.

Co-authorship network of co-authors of Boping Wu

This figure shows the co-authorship network connecting the top 25 collaborators of Boping Wu. A scholar is included among the top collaborators of Boping Wu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Boping Wu. Boping Wu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
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Liu, Lihong, et al.. (2023). Electromagnetic Interference Shielding Solution For System-In-Package. 1–4. 1 indexed citations
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Huang, Shaowu, et al.. (2017). Absorbing Termination for High-Frequency Measurements of Interconnects. IEEE Transactions on Components Packaging and Manufacturing Technology. 7(7). 1173–1184. 2 indexed citations
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Wu, Boping, et al.. (2012). Barbed transmission lines for crosstalk suppression. 621–624. 5 indexed citations
10.
Wu, Boping, et al.. (2012). METHODS AND DESIGNS FOR IMPROVING THE SIGNAL INTEGRITY OF VERTICAL INTERCONNECTS IN HIGH PERFORMANCE PACKAGING. Electromagnetic waves. 123. 1–11. 18 indexed citations
11.
Wu, Boping, Xiaoxiong Gu, Leung Tsang, & Mark B. Ritter. (2011). Electromagnetic modeling of massively coupled through silicon vias for 3D interconnects. Microwave and Optical Technology Letters. 53(6). 1204–1206. 21 indexed citations
12.
Gu, Xiaoxiong, Boping Wu, Mark B. Ritter, & Leung Tsang. (2010). Efficient full-wave modeling of high density TSVs for 3D integration. 663–666. 17 indexed citations
13.
Wu, Boping, et al.. (2009). Electromagnetic fields and modal excitations on a thin silver film. Journal of the Optical Society of America A. 26(11). 2362–2362. 5 indexed citations
14.
Wu, Boping & Leung Tsang. (2009). Signal Integrity Analysis of Package and Printed Circuit Board With Multiple Vias in Substrate of Layered Dielectrics. IEEE Transactions on Advanced Packaging. 33(2). 510–516. 34 indexed citations
15.
Gu, Xiaoxiong, Boping Wu, Christian Baks, & Leung Tsang. (2009). Fast full wave analysis of PCB via arrays with model-to-hardware correlation. 19. 175–178. 6 indexed citations
16.
Wu, Boping & Leung Tsang. (2009). FULL-WAVE MODELING OF MULTIPLE VIAS USING DIFFERENTIAL SIGNALING AND SHARED ANTIPAD IN MULTILAYERED HIGH SPEED VERTICAL INTERCONNECTS. Electromagnetic waves. 97. 129–139. 35 indexed citations
17.
Wu, Boping, et al.. (2008). Fast Computation of Layered Medium Green's Functions of Multilayers and Lossy Media Using Fast All-Modes Method and Numerical Modified Steepest Descent Path Method. IEEE Transactions on Microwave Theory and Techniques. 56(6). 1446–1454. 26 indexed citations
18.
Ong, Chong‐Jin, Boping Wu, Leung Tsang, & Xiaoxiong Gu. (2008). Full-Wave Solver for Microstrip Trace and Through-Hole Via in Layered Media. IEEE Transactions on Advanced Packaging. 31(2). 292–302. 25 indexed citations
19.
Tsang, Leung & Boping Wu. (2007). Electromagnetic Fields of Hertzian Dipoles in Layered Media of Moderate Thickness Including the Effects of All Modes. IEEE Antennas and Wireless Propagation Letters. 6. 316–319. 21 indexed citations
20.
Wu, Boping, Leung Tsang, & Chong‐Jin Ong. (2007). Fast all modes (FAM) method combined with NMSP for evaluating spatial domain layered medium Green's functions of moderate thickness. Microwave and Optical Technology Letters. 49(12). 3112–3118. 9 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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