Boping Wu
Impact in
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- Electromagnetic Compatibility and Noise Suppression
- 3D IC and TSV technologies
- Microwave Engineering and Waveguides
- Electromagnetic Simulation and Numerical Methods
- Electronic Packaging and Soldering Technologies
- Semiconductor Lasers and Optical Devices
- Aerospace Engineering top 10%
- Advanced Antenna and Metasurface Technologies
Papers in ⓘ
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- Advanced Antenna and Metasurface Technologies 13
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- Electromagnetic Compatibility and Noise Suppression 20
- 3D IC and TSV technologies 13
- Microwave Engineering and Waveguides 10
- Electronic Packaging and Soldering Technologies 4
- Semiconductor Lasers and Optical Devices 4
- Radio Frequency Integrated Circuit Design 3
- Co-authors
- Leung Tsang (11 shared papers)Xiaoxiong Gu (6 shared papers)Leung Tsang (1 shared paper)Mark B. Ritter (3 shared papers)Chong‐Jin Ong (2 shared papers)Christian Baks (3 shared papers)Young Kwark (2 shared papers)Lei Shan (2 shared papers)
- Journals
- IEEE Transactions on Advanced Packaging (3 papers)IEEE Antennas and Wireless Propagation Letters (2 papers)Electromagnetic waves (2 papers)Microwave and Optical Technology Letters (2 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)
- Partner nations
- United StatesChinaGermany
In The Last Decade
Boping Wu
33 papers receiving 352 citations
Peers
Comparison fields: 5 of 38
- Electrical and Electronic Engineering 332
- Aerospace Engineering 103
- Atomic and Molecular Physics, and Optics 80
- Surfaces, Coatings and Films 10
- Hardware and Architecture 8
Countries citing papers authored by Boping Wu
This map shows the geographic impact of Boping Wu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Boping Wu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Boping Wu more than expected).
Fields of papers citing papers by Boping Wu
This network shows the impact of papers produced by Boping Wu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Boping Wu. The network helps show where Boping Wu may publish in the future.
Co-authors
The 25 scholars most cited alongside Boping Wu, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 35 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2009 | 63 | |
| 2 | 2009 | 38 | |
| 3 | 2009 | 35 | |
| 4 | 2009 | 34 | |
| 5 | 2008 | 26 | |
| 6 | 2008 | 25 | |
| 7 | 2007 | 21 | |
| 8 | 2011 | 21 | |
| 9 | 2012 | 18 | |
| 10 | 2010 | 17 | |
| 11 | 2007 | 9 | |
| 12 | 2017 | 8 | |
| 13 | 2009 | 6 | |
| 14 | 2009 | 5 | |
| 15 | 2012 | 5 | |
| 16 | 2014 | 4 | |
| 17 | Method to Reduce Coupon Length for S-parameter Measurements | 2015 | 4 |
| 18 | 2008 | 4 | |
| 19 | 2010 | 3 | |
| 20 | 2008 | 3 |
About Boping Wu
Boping Wu is a scholar working on Aerospace Engineering, Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Atomic and Molecular Physics, and Optics and Surfaces, Coatings and Films, having authored 35 papers that have together received 369 indexed citations. Recurring topics across this work include Electromagnetic Compatibility and Noise Suppression (20 papers), 3D IC and TSV technologies (13 papers), Advanced Antenna and Metasurface Technologies (13 papers), Microwave Engineering and Waveguides (10 papers), Electromagnetic Scattering and Analysis (7 papers), Electronic Packaging and Soldering Technologies (4 papers), Semiconductor Lasers and Optical Devices (4 papers) and Radio Frequency Integrated Circuit Design (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (332 citations), Aerospace Engineering (103 citations), Atomic and Molecular Physics, and Optics (80 citations), Surfaces, Coatings and Films (10 citations) and Hardware and Architecture (8 citations). Boping Wu has collaborated with scholars based in United States, China and Germany. Frequent co-authors include Leung Tsang, Xiaoxiong Gu, Leung Tsang, Mark B. Ritter, Chong‐Jin Ong, Christian Baks, Young Kwark, Lei Shan, Renato Rímolo-Donadío and T. Beukema. Their work appears in journals such as IEEE Transactions on Advanced Packaging, IEEE Antennas and Wireless Propagation Letters, Electromagnetic waves, Microwave and Optical Technology Letters and IEEE Transactions on Components Packaging and Manufacturing Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.