B. Salam

1.2k total citations · 1 hit paper
36 papers, 971 citations indexed

About

B. Salam is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Mechanical Engineering. According to data from OpenAlex, B. Salam has authored 36 papers receiving a total of 971 indexed citations (citations by other indexed papers that have themselves been cited), including 26 papers in Electrical and Electronic Engineering, 16 papers in Biomedical Engineering and 11 papers in Mechanical Engineering. Recurrent topics in B. Salam's work include Electronic Packaging and Soldering Technologies (17 papers), 3D IC and TSV technologies (11 papers) and Advanced Sensor and Energy Harvesting Materials (10 papers). B. Salam is often cited by papers focused on Electronic Packaging and Soldering Technologies (17 papers), 3D IC and TSV technologies (11 papers) and Advanced Sensor and Energy Harvesting Materials (10 papers). B. Salam collaborates with scholars based in Singapore, United Kingdom and China. B. Salam's co-authors include Xuechuan Shan, Chengkuo Lee, Zixuan Zhang, Qiongfeng Shi, Yong‐Xin Guo, Kush Agarwal, N.N. Ekere, R. Durairaj, Yanqin Yang and Tianyiyi He and has published in prestigious journals such as Nature Communications, ACS Nano and Synthetic Metals.

In The Last Decade

B. Salam

36 papers receiving 940 citations

Hit Papers

Deep learning enabled smart mats as a scalable floor moni... 2020 2026 2022 2024 2020 50 100 150 200 250
What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

  1. Deep learning enabled smart mats as a scalable floor monitoring system
    2020 258 citations Qiongfeng Shi, Zixuan Zhang et al. Nature Communications profile →

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
B. Salam Singapore 14 543 454 249 187 172 36 971
Yuan Fang China 18 304 0.6× 269 0.6× 195 0.8× 77 0.4× 190 1.1× 39 748
Lina Castano United States 7 498 0.9× 179 0.4× 111 0.4× 109 0.6× 260 1.5× 15 727
Hao Dang China 17 423 0.8× 358 0.8× 96 0.4× 145 0.8× 54 0.3× 43 1.2k
Cheng‐Yao Lo Taiwan 17 491 0.9× 317 0.7× 47 0.2× 218 1.2× 47 0.3× 82 802
Raúl Fernández‐García Spain 19 583 1.1× 561 1.2× 398 1.6× 47 0.3× 92 0.5× 91 1.1k
Qiang Shen China 15 311 0.6× 448 1.0× 181 0.7× 33 0.2× 106 0.6× 68 950
Mahmoud Wagih United Kingdom 22 525 1.0× 1.0k 2.3× 641 2.6× 53 0.3× 173 1.0× 98 1.4k
Wenjing Su United States 18 435 0.8× 778 1.7× 253 1.0× 32 0.2× 84 0.5× 48 1.1k
Xinyue Tang China 11 305 0.6× 199 0.4× 103 0.4× 119 0.6× 95 0.6× 23 591
Ping Ren China 11 379 0.7× 234 0.5× 92 0.4× 82 0.4× 114 0.7× 52 711

Countries citing papers authored by B. Salam

Since Specialization
Citations

This map shows the geographic impact of B. Salam's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by B. Salam with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites B. Salam more than expected).

Fields of papers citing papers by B. Salam

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by B. Salam. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by B. Salam. The network helps show where B. Salam may publish in the future.

Co-authorship network of co-authors of B. Salam

This figure shows the co-authorship network connecting the top 25 collaborators of B. Salam. A scholar is included among the top collaborators of B. Salam based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with B. Salam. B. Salam is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
2.
Yang, Yanqin, Qiongfeng Shi, Zixuan Zhang, et al.. (2022). Robust triboelectric information‐mat enhanced by multi‐modality deep learning for smart home. InfoMat. 5(1). 67 indexed citations
3.
Shi, Qiongfeng, Zixuan Zhang, Tianyiyi He, et al.. (2020). Deep learning enabled smart mats as a scalable floor monitoring system. Nature Communications. 11(1). 4609–4609. 258 indexed citations breakdown →
4.
Salam, B., et al.. (2020). Washability of Flexible Printed Circuitry for Wearable Electronics Applications. 207–209. 1 indexed citations
5.
Salam, B., Z. H. Cen, Xuechuan Shan, & B. K. Lok. (2019). Printing Process of Electrically Conductive Silver on Heat Transfer Polymer Substrates for Wearable Electronics Applications. 81. 645–648. 2 indexed citations
6.
Cen, Z. H., et al.. (2019). Design of Flexible Printed Heater to Improve Uniform Heating. 649–653. 3 indexed citations
7.
Salam, B., et al.. (2018). Multilayer Roll-to-Roll Screen-Printing for Printed Electronics Applications. 15. 359–362. 2 indexed citations
8.
Salam, B., Xuechuan Shan, & Jun Wei. (2016). Large area roll-to-roll screen printing of electrically conductive circuitries. 1. 250–253. 4 indexed citations
9.
Shan, Xuechuan, et al.. (2016). Process considerations, process challenges and manufacturing systems for roll-to-roll processing. 21. 684–687. 1 indexed citations
10.
Wiria, Florencia Edith, et al.. (2015). Improving surface quality of polyethylene terephthalate film for large area flexible electronic applications. Journal of Solid State Electrochemistry. 20(7). 1895–1902. 8 indexed citations
11.
Kim, Jaewon, Byunghoon Lee, Jun Yan Lek, et al.. (2014). Characterization of copper conductive ink for low temperature sintering processing on flexible polymer substrate. 6. 27–30. 7 indexed citations
12.
Ltaief, A., Bouraoui Ilahi, B. Salam, et al.. (2014). Improved photovoltaic performance of silicon nanowires/conjugated polymer hybrid solar cells. Synthetic Metals. 191. 6–11. 13 indexed citations
13.
Agarwal, Kush, et al.. (2013). Latex based near-endfire wearable antenna backed by AMC surface. 1–3. 8 indexed citations
14.
Wang, Lei, et al.. (2012). A flexible modified dipole antenna printed on PET film. National University of Singapore. 239–240. 16 indexed citations
15.
Salam, B., et al.. (2011). Low temperature processing of copper conductive ink for printed electronics applications. 14. 251–255. 5 indexed citations
16.
Lin, Kwang‐Lung, et al.. (2008). Suppressing Growth of the Cu5Zn8 Intermetallic Layer in Sn-Zn-Ag-Al-Ga/Cu Solder Joints. Journal of Electronic Materials. 38(1). 88–92. 14 indexed citations
17.
Salam, B., N.N. Ekere, & R. Durairaj. (2006). A Study of Inter-Metallic Compounds (IMC) Formation and Growth in Ultra-Fine Pitch Sn-Ag-Cu Lead-Free Solder Joints. Greenwich Academic Literature Archive (University of Greenwich). 988–994. 10 indexed citations
18.
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20.
Ekere, N.N., et al.. (2000). Rework techniques process evaluation for chip scale packages. IEEE Transactions on Electronics Packaging Manufacturing. 23(3). 200–207. 8 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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