Standout Papers

Advances on Thermally Conductive Epoxy‐Based Composites as Electronic Packaging Underfill Materials—A Review 2022 2026 2023 2024218
  1. Advances on Thermally Conductive Epoxy‐Based Composites as Electronic Packaging Underfill Materials—A Review (2022)
    Yingfeng Wen, Chao Chen et al. Advanced Materials

Immediate Impact

4 from Science/Nature 59 standout
Sub-graph 1 of 22

Citing Papers

Biopolymer‐Based Flame Retardants and Flame‐Retardant Materials
2025 Standout
Advances in conducting nanocomposite hydrogels for wearable biomonitoring
2025 Standout
6 intermediate papers

Works of Yingfeng Wen being referenced

Advances on Thermally Conductive Epoxy‐Based Composites as Electronic Packaging Underfill Materials—A Review
2022 Standout
Novel micro-nano epoxy composites for electronic packaging application: Balance of thermal conductivity and processability
2021
and 3 more

Author Peers

Author Last Decade Papers Cites
Yingfeng Wen 757 303 707 310 22 1.4k
Guojian Wang 541 241 850 228 56 1.4k
Yalan Wu 807 529 568 246 10 1.3k
Mingxia Shen 421 407 645 230 44 1.2k
Zhengbin Xia 690 252 761 112 46 1.5k
Zheng Liu 510 452 543 398 34 1.2k
Chang‐An Xu 627 374 896 189 51 1.4k
Jing Dang 847 363 513 373 37 1.4k
Xiaobing Yang 584 325 306 604 42 1.5k
Dongxian Zhuo 570 267 825 518 54 1.4k
Delong Xie 670 165 545 144 40 1.2k

All Works

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Rankless by CCL
2026