Xiaofeng Yang

Comprehensive review and future prospects on chip-scale thermal management: Core of data center’s thermal management

Design of efficient microstructured path by magnetic orientation boron nitride nanosheets/MnFe2O4 enabling waterborne polyurethane with high thermal conductivity and flame retardancy

Bioinspired sweating with temperature sensitive hydrogel to passively dissipate heat from high-end wearable electronics