Xiangyang Lei

Hyper-reduction modeling and energy transfer analysis of fluid-transporting series-parallel pipes

Predictive models for the surface roughness and subsurface damage depth of semiconductor materials in precision grinding

An experimental and theoretical investigation on the brittle ductile transition and cutting force anisotropy in cutting KDP crystal

Morphology and distribution of subsurface damage in optical fused silica parts: Bound-abrasive grinding