Immediate Impact
8 standout
Citing Papers
Multiscale plastic deformation in additively manufactured FeCoCrNiMo high-entropy alloys to achieve strength–ductility synergy at elevated temperatures
2024 Standout
Eutectic high-entropy alloys and their applications in materials processing engineering: A review
2024 Standout
Works of Weimin Long being referenced
Effect of CuZnAl particles addition on microstructure of Cu/Sn58Bi/Cu TLP bonding solder joints
2019
Materials, processing and reliability of low temperature bonding in 3D chip stacking
2018
Author Peers
| Author | Last Decade | Papers | Cites | |||
|---|---|---|---|---|---|---|
| Weimin Long | 775 | 410 | 347 | 112 | 1.1k | |
| Dong‐Won Lee | 498 | 470 | 610 | 81 | 1.3k | |
| Magnus Rohde | 347 | 572 | 433 | 65 | 1.1k | |
| Werner Riehemann | 779 | 171 | 482 | 108 | 1.2k | |
| W.P. Vellinga | 457 | 299 | 432 | 42 | 1.0k | |
| Yong Xiao | 536 | 513 | 184 | 45 | 898 | |
| Haiyun Jin | 313 | 372 | 457 | 46 | 947 | |
| Xiangyu Dai | 611 | 283 | 354 | 51 | 1.0k | |
| Min Tae Kim | 406 | 269 | 392 | 51 | 912 | |
| Jianyun Shen | 916 | 237 | 385 | 55 | 1.1k | |
| Chao Huang | 461 | 494 | 405 | 63 | 1.2k |
All Works
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