Standout Papers

Microstructured BN Composites with Internally Designed High Thermal Conductivity Paths for 3D Electronic Packaging 2022 2026 2023 2024142
  1. Microstructured BN Composites with Internally Designed High Thermal Conductivity Paths for 3D Electronic Packaging (2022)
    Hongying He, Junbo Liu et al. Advanced Materials

Immediate Impact

30 standout
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3 intermediate papers

Works of Shike Liu being referenced

Microstructured BN Composites with Internally Designed High Thermal Conductivity Paths for 3D Electronic Packaging
2022 Standout

Author Peers

Author Last Decade Papers Cites
Shike Liu 157 45 77 125 27 447
Man Li 152 56 82 63 30 409
Yifan Zhao 127 26 44 230 41 498
Da Wei Li 155 56 150 106 34 479
Yan Li 140 22 94 66 45 489
Minjun Kim 172 37 85 58 48 415
Xin‐Yang Liu 85 46 36 130 28 479
Jian Ye 76 32 28 100 44 463
Xiang Zhang 102 90 53 79 26 489
Yaping Qin 138 32 139 78 20 483
Xu Tang 134 48 135 82 61 506

All Works

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2026