Immediate Impact
3 hit
Citing Papers
Recent Advances and Trends in Advanced Packaging
2022 Hit
Next generation ferroelectric materials for semiconductor process integration and their applications
2021 Hit
Works of Sangjin Hyun being referenced
Cu Microstructure of High Density Cu Hybrid Bonding Interconnection
2019
Ferroelectricity in undoped-HfO2 thin films induced by deposition temperature control during atomic layer deposition
2016