Standout Papers

Review on polymer composites with high thermal conductivity and low dielectric properties for electronic packagin... 2021 2026 2022 2024230
  1. Review on polymer composites with high thermal conductivity and low dielectric properties for electronic packaging (2021)
    Ran Li, Xiao Yang et al. Materials Today Physics

Immediate Impact

2 by Nobel laureates 53 standout
Sub-graph 1 of 23

Citing Papers

Artificial intelligence and adaptive response to market changes: A strategy to enhance firm performance and innovation
2024 Standout
Highly-efficient filtered hierarchical identification algorithms for multiple-input multiple-output systems with colored noises
2024 Standout
2 intermediate papers

Works of Ruqian Lu being referenced

Networked Knowledge and Complex Networks: An Engineering View
2022
Automatic generation of computeranimation: using AI for movie animation
2002

Author Peers

Author Last Decade Papers Cites
Ruqian Lu 211 125 67 166 55 676
Yi Wang 182 55 26 75 70 793
Sichun Wang 121 69 23 125 60 788
Qihang Lin 288 52 15 120 58 827
Jiaxin Jiang 86 81 35 75 75 638
Hao Liao 152 21 78 112 58 748
Junfeng Chen 333 77 96 99 56 731
Yuan Jiang 198 19 29 127 54 821
Ahmed El-Sawy 137 45 37 114 56 798
Xianxia Zhang 156 34 11 86 46 820
Bhavya Kailkhura 309 63 28 190 49 792

All Works

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Rankless by CCL
2026