R.T. Chen

Device Requirements for Optical Interconnects to Silicon Chips

Attosecond metrology: from electron capture to future signal processing

Rationale and challenges for optical interconnects to electronic chips

The future of wires

Receiver-less optical clock injection for clock distribution networks

On-Chip Communication Architectures: System on Chip Interconnect

Hydrogel bioelectronics

Electrical interconnects revitalized

Power Comparison Between High-Speed Electrical and Optical Interconnects for Interchip Communication

Demonstration of optical gain at 1.06 μm in a neodymium-doped polyimide waveguide

Analysis on absorption spectra of Nd3+ in poly(methyl methacrylate)

Low-cost microoptical modules for mcm level optical interconnections

Optical beamsteering using integrated optical modulators

3-D ICs: a novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration

Survey on Free Space Optical Communication: A Communication Theory Perspective

Silicon optical modulators

Lanthanide-Based Luminescent Hybrid Materials

Amplified spontaneous emission of an Nd3+-doped poly(methyl methacrylate) optical fiber at ambient temperature

A Materials Roadmap to Functional Neural Interface Design

Optical interconnects: out of the box forever?

Polymer-based photonic integrated circuits

Optoelectronic integration of polymer waveguide array and metal-semiconductor-metal photodetector through micromirror couplers

Channel cross-coupling in a polymer-based single-mode bus array

Si-based surface-relief polygonal gratings for 1-to-many wafer scale optical clock signal distribution

Flexible optical waveguide film fabrications and optoelectronic devices integration for fully embedded board-level optical interconnects

Fully embedded board-level guided-wave optoelectronic interconnects

An optical centralized shared-bus architecture demonstrator for microprocessor-to-memory interconnects

Crosstalk and interconnection distance considerations for board-to-board optical interconnects using 2-D VCSEL and microlens array