Immediate Impact
10 standout
Citing Papers
Connecting the Dots: Sintering of Liquid Metal Particles for Soft and Stretchable Conductors
2025 Standout
Highly Thermally Conductive Aramid Nanofiber Composite Films with Synchronous Visible/Infrared Camouflages and Information Encryption
2024 Standout
Works of Ming-Yao Yen being referenced
Microvia Filling by Cu Electroplating Over a Au Seed Layer Modified by a Disulfide
2009
Through-Hole Filling by Copper Electroplating
2008
Author Peers
| Author | Last Decade | Papers | Cites | |||
|---|---|---|---|---|---|---|
| Ming-Yao Yen | 869 | 430 | 265 | 14 | 895 | |
| D. Josell | 789 | 382 | 329 | 10 | 828 | |
| T. P. Moffat | 765 | 348 | 307 | 8 | 802 | |
| David J. Comstock | 505 | 504 | 245 | 16 | 935 | |
| Qiongyu Li | 457 | 857 | 141 | 13 | 1.0k | |
| Ming Chu | 470 | 414 | 118 | 9 | 778 | |
| Raghuveer S. Makala | 284 | 623 | 96 | 18 | 764 | |
| Andreas Krause | 731 | 266 | 332 | 23 | 855 | |
| M. Olschewski | 760 | 501 | 144 | 18 | 984 | |
| Misle M. Tessema | 543 | 331 | 212 | 15 | 836 | |
| Monica D. Edelstein | 657 | 290 | 125 | 13 | 759 |
All Works
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