Immediate Impact

3 from Science/Nature 50 standout
Sub-graph 1 of 25

Citing Papers

Adhesively bonded joints – A review on design, manufacturing, experiments, modeling and challenges
2024 Standout
Advances on Thermally Conductive Epoxy‐Based Composites as Electronic Packaging Underfill Materials—A Review
2022 Standout
2 intermediate papers

Works of Maurice E. Edwards being referenced

Towards model-based engineering of underfill materials: CTE modeling
2001

Author Peers

Author Last Decade Papers Cites
Maurice E. Edwards 107 130 4 37 10 252
J. S. Rice 50 78 60 18 266
Amir Ali Khoddamzadeh 133 45 2 109 26 261
Tingting Zhao 60 69 19 88 18 240
Lijuan Su 65 51 6 80 28 275
Jiqing Zeng 134 35 2 53 15 290
Loutfy I. El-Juhany 150 22 8 37 8 238
Hanno Schäfer 41 55 1 14 11 247
Xue Yin 16 25 1 22 21 294
C. Panter 44 21 3 27 18 297
Simona Lazzeri 73 12 1 13 16 268

All Works

Loading papers...

Rankless by CCL
2026