Mark A. Crowder

3-D ICs: Motivation, performance analysis, and technology

Device Requirements for Optical Interconnects to Silicon Chips

Inorganic Semiconductors for Flexible Electronics

A strategy for modeling of variations due to grain size in polycrystalline thin-film transistors

Interconnect limits on gigascale integration (GSI) in the 21st century

HotSpot: a compact thermal modeling methodology for early-stage VLSI design

3-D ICs: a novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration

Nanoscale thermal transport

Materials and Mechanics for Stretchable Electronics

Flexible Nanogenerators for Energy Harvesting and Self‐Powered Electronics

Stretchable and Foldable Silicon Integrated Circuits

Single-crystal Si films for thin-film transistor devices

Low-temperature single-crystal Si TFTs fabricated on Si films processed via sequential lateral solidification