M. Palmer

Liquid metal cooling in thermal management of computer chips

Computer simulation of grain growth kinetics with solute drag

Three-dimensional analysis of grain topology and interface curvature in a β-titanium alloy

Liquid phase sintered Cu–In composite solders for thermal interface material and interconnect applications

Phase-Field Models for Microstructure Evolution

Overview of constitutive laws, kinematics, homogenization and multiscale methods in crystal plasticity finite-element modeling: Theory, experiments, applications

Introduction of a scalable three-dimensional cellular automaton with a probabilistic switching rule for the discrete mesoscale simulation of recrystallization phenomena

Large-scale 3D random polycrystals for the finite element method: Generation, meshing and remeshing

Computer simulation of topological evolution in 2-D grain growth using a continuum diffuse-interface field model

Computer simulation of grain growth using a continuum field model

Carbon materials for structural self-sensing, electromagnetic shielding and thermal interfacing

Micro-Encapsulated Phase Change Materials: A Review of Encapsulation, Safety and Thermal Characteristics

Topological rearrangements during 2D normal grain growth

Two-dimensional grain growth in rapidly solidified succinonitrile films

Experimental assessment of the Mullins - Von Neumann grain growth law

Forming high temperature solder joints through liquid phase sintering of solder paste

Topological events in two-dimensional grain growth: Experiments and simulations