Standout Papers

Thin Films—Interdiffusion and Reactions 1973 2026 1990 2008 1.4k
  1. Thin Films—Interdiffusion and Reactions (1979)
    J. M. Poate, K. N. Tu et al. Journal of The Electrochemical Society
  2. Six cases of reliability study of Pb-free solder joints in electronic packaging technology (2002)
    Ke Zeng, K. N. Tu Materials Science and Engineering R Reports
  3. Recent advances on electromigration in very-large-scale-integration of interconnects (2003)
    K. N. Tu Journal of Applied Physics
  4. Stress evolution due to electromigration in confined metal lines (1993)
    M. A. Korhonen, P. Bo rgesen et al. Journal of Applied Physics
  5. Interdiffusion and reaction in bimetallic Cu-Sn thin films (1973)
    K. N. Tu Acta Metallurgica

Immediate Impact

1 by Nobel laureates 46 from Science/Nature 75 standout
Sub-graph 1 of 22

Citing Papers

An autonomous laboratory for the accelerated synthesis of inorganic materials
2023 StandoutNature
Self-assembled monolayers direct a LiF-rich interphase toward long-life lithium metal batteries
2022 StandoutScience
7 intermediate papers

Works of K. N. Tu being referenced

Tin whiskers studied by synchrotron radiation scanning X-ray micro-diffraction
2003
Irreversible processes of spontaneous whisker growth in bimetallic Cu-Sn thin-film reactions
1994
and 4 more

Author Peers

Author Last Decade Papers Cites
K. N. Tu 9585 3790 4677 177 12.0k
F. M. d’Heurle 5040 5265 1839 205 7.7k
S. P. Murarka 5153 3644 1647 224 7.6k
Anton Van der Ven 10815 1139 2712 216 14.9k
Paul S. Ho 4472 1101 1323 320 7.4k
Tilmann Hickel 1909 1343 3035 158 8.8k
Blazej Grabowski 1901 1095 3705 142 9.0k
J. W. Morris 2653 741 7103 252 11.0k
Shun‐Li Shang 1897 935 5464 332 11.3k
L.V. Panina 2270 3033 3451 186 8.0k
J. Washburn 3645 2776 762 258 6.4k

All Works

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2026