Jinhu Wang

55 papers · 387 indexed citations

Immediate Impact

30 hit

Sub-graph 1 of 15

Predictive models for the surface roughness and subsurface damage depth of semiconductor materials in precision grinding

2025 Hit

A novel liquid film shearing polishing technique for silicon carbide and its processing damage mechanisms

2025 Hit

1 intermediate paper

Force Rheological Polishing Technology

2022

Review on Material Removal Model of Flexible Contact Polishing Based on Rheological Principle

2020

Peers are selected by citation overlap in the author's most active subfields. citations · hero ref

Author						Papers	Cites
Jinhu Wang	97	90	59	53	51	55	387
Xu Zhu	80 0.8×	50 0.6×	26 0.4×	35 0.7×	13 0.3×	48	429
Liu Da	44 0.5×	34 0.4×	53 0.9×	44 0.8×	31 0.6×	48	362
Jun Ren	63 0.6×	97 1.1×	20 0.3×	90 1.7×	28 0.5×	59	348
Yanfeng Yang	39 0.4×	180 2.0×	35 0.6×	68 1.3×	43 0.8×	33	377
Peng Yu	77 0.8×	84 0.9×	20 0.3×	32 0.6×	50 1.0×	38	445
A. F. Ali	73 0.8×	49 0.5×	17 0.3×	17 0.3×	25 0.5×	91	362
Xinxin Guo	71 0.7×	59 0.7×	36 0.6×	49 0.9×	11 0.2×	37	396
Fengjun Wang	67 0.7×	42 0.5×	93 1.6×	23 0.4×	12 0.2×	35	422
Chaoran Wang	62 0.6×	112 1.2×	48 0.8×	15 0.3×	11 0.2×	37	374
Hongbo Guo	109 1.1×	43 0.5×	23 0.4×	51 1.0×	8 0.2×	43	441

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