Immediate Impact
62 standout
Citing Papers
Flexible solid-liquid bi-continuous electrically and thermally conductive nanocomposite for electromagnetic interference shielding and heat dissipation
2024 Standout
Slippery Graphene-Bridging Liquid Metal Layered Heterostructure Nanocomposite for Stable High-Performance Electromagnetic Interference Shielding
2023 Standout
Works of Gerard McVicker being referenced
Thermomechanical modeling of 3D electronic packages
2008
Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection
2005
Author Peers
| Author | Last Decade | Papers | Cites | |||||
|---|---|---|---|---|---|---|---|---|
| Gerard McVicker | 130 | 9 | 4 | 42 | 24 | 4 | 168 | |
| A. Sharma | 131 | 22 | 24 | 5 | 158 | |||
| Phyo Aung Kyaw | 141 | 4 | 24 | 22 | 8 | 153 | ||
| Shawn A. Adderly | 209 | 3 | 42 | 21 | 4 | 240 | ||
| Ke Qiu | 206 | 7 | 5 | 74 | 29 | 7 | 290 | |
| Mohammad Hassan Ghaed | 155 | 2 | 2 | 79 | 49 | 5 | 206 | |
| R. Yu | 154 | 57 | 10 | 6 | 179 | |||
| Seungbum Lim | 170 | 15 | 33 | 6 | 189 | |||
| Jizheng Qiu | 156 | 1 | 29 | 46 | 8 | 202 | ||
| Nishad Patil | 234 | 13 | 21 | 8 | 280 | |||
| Helmut Kipphan | 60 | 8 | 55 | 14 | 6 | 162 |
All Works
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