D. Vogel

Finite element formulation for a digital image correlation method

Nanoscale deformation measurement of microscale interconnection assemblies by a digital image correlation technique

Two-dimensional digital image correlation for in-plane displacement and strain measurement: a review

Experimental and numerical investigations of near-crack-tip deformation in a solder alloy

Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications

The effect of curing on the performance of ACF bonded chip‐on‐flex assemblies after thermal ageing

Study of optimal subset size in digital image correlation of speckle pattern images

FibDAC - Residual Stress Determination by Combination of Focused Ion Beam Technique and Digital Image Correlation

Ncorr: Open-Source 2D Digital Image Correlation Matlab Software

Small-scale patterning methods for digital image correlation under scanning electron microscopy

Residual stress and its role in failure

Residual Stress Measurement on a MEMS Structure With High-Spatial Resolution

Surface integrity in material removal processes: Recent advances

Micro- and nanomaterials characterization by image correlation methods

Effect of bump height on the strain variation during the thermal cycling test of ACA flip-chip joints

Determination of Packaging Material Properties Utilizing Image Correlation Techniques

Thermal and mechanical analysis of micromachined gas sensors

MicroDAC strain measurement for electronics packaging structures

Digital image correlation of nanoscale deformation fields for local stress measurement in thin films

Microdac — A novel approach to measure in situ deformation fields of microscopic scale

FIB-based technique for stress characterization on thin films for reliability purposes

Measurement of residual stresses in micromachined structures in a microregion