Citation Impact
Citing Papers
Six cases of reliability study of Pb-free solder joints in electronic packaging technology
2002 Standout
Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications
2006 Standout
ITRI project on electroless nickel/immersion gold joint cracking
2000
Metal-based reactive nanomaterials
2008 Standout
Investigations on electrical and energy storage behaviour of PZN-PT, PMN-PT, PZN–PMN-PT piezoelectric solid solutions
2018
A New COG Technique Using Low Temperature Solder Bumps for LCD Driver IC Packaging Applications
2004
Interfacial reactions between lead-free solders and common base materials
2005 Standout
Electroceramics for High-Energy Density Capacitors: Current Status and Future Perspectives
2021 Standout
Works of Chang‐Bae Lee being referenced
The Effect of Bi Concentration on Wettability of Cu Substrate by Sn-Bi Solders
2001
Effect of Surface Finishes on Ball Shear Strength in BGA Joints with Sn-3.5 mass%Ag Solder
2002
Microstructural, dielectric and piezoelectric properties of low-temperature sintering Pb(Co1/2W1/2)O3–Pb(Mn1/2Nb2/3)O3–Pb(Zr,Ti)O3 ceramics with the addition of Li2CO3 and Bi2O3
2005
Growth of an intermetallic compound layer with Sn-3.5Ag-5Bi on Cu and Ni-P/Cu during aging treatment
2003