Caiyu Guo

Additive friction stir deposition of AA5083/MoS2-diamond hybrid nanocomposites: Investigating their metallurgical, mechanical, tribological, and electrochemical characteristics, and process-structure-property relationships

Comprehensive review and future prospects on chip-scale thermal management: Core of data center’s thermal management

Effect of (0–40) wt. % Si addition to Al on the thermal conductivity and thermal expansion of diamond/Al composites by pressure infiltration

Preparation of copper–diamond composites with chromium carbide coatings on diamond particles for heat sink applications