Citation Impact

Citing Papers

The Changing Automotive Environment: High-Temperature Electronics
2004 Standout
Thermal cycling reliability of lead‐free chip resistor solder joints
2004

Works of Bob Sullivan being referenced

Design for lead‐free solder joint reliability of high‐density packages
2004
Reliability testing and data analysis of lead‐free solder joints for high‐density packages
2004
Rankless by CCL
2026